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STA333MLJ13TR

STMicroelectronics

STA333MLJ13TR by STMicroelectronics

STA333MLJ13TR by STMicroelectronics is a compact consumer IC designed for efficient audio applications. It operates b/w 4.5V and 18V, with a max temp of 70 °C and features a dual terminal layout in a small outline package. Ideal for space-constrained designs, it ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,134 parts In-Stock

1+ parts

-

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5,134

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Anansix

USA . 2,501 parts In-Stock

1+ parts

-

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2,501

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Digiode

USA . 2,222 parts In-Stock

1+ parts

-

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2,222

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 71 parts In-Stock

1+ parts

$2.173

100+ parts

-

1k+ parts

$1.956

10k+ parts

-

71

$2.173

-

$1.956

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MKK Technologies

India . 1,064 parts In-Stock

1+ parts

$4.086

100+ parts

-

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-

10k+ parts

-

1,064

$4.086

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DigiPath Technology Company

USA . 1,064 parts In-Stock

1+ parts

$4.086

100+ parts

-

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-

1,064

$4.086

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Microchip USA

USA . 2,069 parts In-Stock

1+ parts

$11.429

100+ parts

-

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2,069

$11.429

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-

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AZTECH Wire

Italy . 413 parts In-Stock

1+ parts

$14.930

100+ parts

-

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10k+ parts

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413

$14.930

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Authorized Procurement Solutions

USA . 180,500 parts In-Stock

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180,500

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RC Electronics

USA . 19,475 parts In-Stock

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19,475

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Futuretech Components

Singapore . 8,360 parts In-Stock

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8,360

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Kepictronics

USA . 6,380 parts In-Stock

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6,380

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Corphita

USA . 2,956 parts In-Stock

1+ parts

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2,956

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Vigor

Singapore . 2,800 parts In-Stock

1+ parts

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2,800

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A-Z Elektronik GmbH

Germany . 2,514 parts In-Stock

1+ parts

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2,514

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Parana Technologies

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

$2.598

1k+ parts

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10k+ parts

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2,220

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$2.598

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Overview

Elevate your audio experience with the STA333MLJ13TR from STMicroelectronics, a leader in innovation and quality. This compact consumer IC delivers reliable performance for a range of applications, ensuring crystal-clear sound in everything from home audio systems to portable devices. With its robust design and efficient power management, you can trust that the STA333MLJ13TR enhances your products, adding value and longevity while meeting the demands of modern technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic epoxy ensures that the product is lightweight yet robust, making it suitable for various consumer electronics applications.

Surface Mount: YES

Being surface mount technology (SMT) compatible allows for easier integration into compact electronic designs, enhancing space efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, allowing for efficient layout and component placement.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, this IC caters well to the needs of everyday electronic devices.

No. of Terminals: 36

With 36 terminals, this IC can support complex functionalities and multiple connections, providing versatility in design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink design facilitate better thermal management, ensuring reliable performance in energy-sensitive applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows for stable performance in typical consumer conditions, enhancing reliability.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C means the IC is suitable for a wide range of environments, including colder climates.

Terminal Position: DUAL

Having dual terminal positions increases connectivity options and layout flexibility on the PCB.

Maximum Seated Height: 2.47 mm

A low seated height minimizes the overall profile of the device, which is beneficial in compact device designs.

Width: 7.5 mm

A moderate width makes it ideal for fitting into narrow spaces without compromising on connectivity.

Minimum Supply Voltage (Vsup): 4.5 V

This minimum supply voltage allows for compatibility with a variety of power supply designs, enhancing its versatility.

Length: 10.3 mm

The length is optimized for compact designs, making it suitable for applications where space is at a premium.

Temperature Grade: COMMERCIAL

Commercial grade temperature classification ensures reliability for everyday consumer products where performance is critical.

Terminal Form: GULL WING

Gull wing terminals support easy soldering and provide excellent mechanical strength, improving durability in consumer applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts, which is ideal for modern electronic designs focused on miniaturization.

Maximum Supply Voltage (Vsup): 18 V

With a high maximum supply voltage of 18 V, this IC can operate effectively in various power environments, offering flexibility in design.

Technical Specifications

Other Function Consumer ICs STA333MLJ13TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

STA333MLJ13TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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