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STA323W13TR

STMicroelectronics

STA323W13TR by STMicroelectronics

STA323W13TR by STMicroelectronics is a consumer IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 36-terminal package with a max supply voltage of 3.6V and supports surface mount technology. Ideal for efficient power management in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,160 parts In-Stock

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7,160

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Digiode

USA . 3,746 parts In-Stock

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3,746

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Anansix

USA . 2,206 parts In-Stock

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2,206

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Vyrian

USA . 2,170 parts In-Stock

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2,170

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ACDS - Activité Composants Distribution Service

France . 560 parts In-Stock

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560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 218 parts In-Stock

1+ parts

$0.973

100+ parts

-

1k+ parts

$0.876

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-

218

$0.973

-

$0.876

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MKK Technologies

India . 345 parts In-Stock

1+ parts

$1.830

100+ parts

-

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345

$1.830

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DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

$1.830

100+ parts

-

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345

$1.830

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Vigor

Singapore . 574 parts In-Stock

1+ parts

$4.860

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-

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574

$4.860

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Microchip USA

USA . 100 parts In-Stock

1+ parts

$5.604

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-

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100

$5.604

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AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$15.250

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876

$15.250

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Ampacity Inc.

Singapore . 1,344 parts In-Stock

1+ parts

$18.800

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1,344

$18.800

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Kepictronics

USA . 12,400 parts In-Stock

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Authorized Procurement Solutions

USA . 11,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,727 parts In-Stock

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5,727

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RC Electronics

USA . 1,618 parts In-Stock

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1,618

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Perfect Parts

USA . 1,254 parts In-Stock

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Assy Fe

Spain . 1,189 parts In-Stock

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1,189

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Corphita

USA . 646 parts In-Stock

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646

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Parana Technologies

USA . 641 parts In-Stock

1+ parts

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$1.164

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641

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$1.164

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Cyclops Electronics Ltd (Excess)

UK . 560 parts In-Stock

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560

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Glotronic Ltd.

UK . 448 parts In-Stock

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448

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ChipstoGo Electronic ltd

UK . 251 parts In-Stock

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251

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Overview

Unlock unparalleled audio experiences with the STA323W13TR from STMicroelectronics, a trusted leader in high-quality consumer ICs. Designed for versatility, this compact solution enhances sound performance in various applications such as TVs, home theaters, and portable devices. Enjoy its reliability across extreme temperatures, ensuring optimal operation wherever you need it. Elevate your projects with the STA323W13TR, where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection in various environments, making this IC suitable for consumer applications.

Surface Mount: YES

Surface mount compatibility allows for efficient PCB assembly and reduces space requirements, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout on a circuit board and enables efficient placement alongside other components.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in everyday electronic products.

Power Supplies (V): 3.3

Operates at a common supply voltage of 3.3V, compatible with a wide range of consumer devices.

No. of Terminals: 36

A sufficient number of terminals provides flexibility for various connections and functionality in complex circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The compact package style aids in efficient heat dissipation and minimizes space on PCBs.

Maximum Operating Temperature: 85 °C

Suitable for applications that operate in higher temperature environments, enhancing reliability.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures makes it ideal for outdoor devices and rugged applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish minimizes oxidation, ensuring better solderability and reliable connections.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and ease of integration into various circuits.

Maximum Seated Height: 3.6 mm

A low seated height enables it to fit into thinner designs, catering to modern, space-constrained applications.

Width: 11 mm

A compact width suits devices with limited physical space while allowing for efficient layout.

Minimum Supply Voltage (Vsup): 3 V

Designed to operate down to 3V, providing versatility in power supply choices for designers.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a reasonable reflow time ensures compatibility with standard manufacturing processes.

Peak Reflow Temperature °C: 245

A peak reflow temperature that accommodates common soldering processes, enhancing manufacturability.

Length: 15.9 mm

The compact length helps in fitting the IC into smaller electronic devices without compromising performance.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures means it can withstand harsh operating environments, increasing reliability.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability on PCBs.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for denser component placement, enabling more functionalities in smaller areas.

Moisture Sensitivity Level (MSL): 3

A moderate MSL indicates a balance between moisture sensitivity and handling requirements, simplifying manufacturing.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide range of supply voltages, offering flexibility for various consumer device designs.

Technical Specifications

Other Function Consumer ICs STA323W13TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

STA323W13TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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