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STA321MP

STMicroelectronics

STA321MP by STMicroelectronics

STA321MP by STMicroelectronics is a 56-terminal consumer IC with 3.3V power supply, operating b/w 0-70 °C. It comes in a square chip carrier package style and is suitable for various consumer circuit applications due to its compact size and commercial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,105 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,105

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Vyrian

USA . 982 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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982

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Digiode

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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480

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,127 parts In-Stock

1+ parts

$1.048

100+ parts

-

1k+ parts

$0.943

10k+ parts

-

1,127

$1.048

-

$0.943

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MKK Technologies

India . 2,197 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

-

10k+ parts

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2,197

$1.970

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DigiPath Technology Company

USA . 2,197 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

-

10k+ parts

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2,197

$1.970

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-

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Corphita

USA . 2,648 parts In-Stock

1+ parts

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2,648

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Parana Technologies

USA . 2,095 parts In-Stock

1+ parts

-

100+ parts

$1.253

1k+ parts

-

10k+ parts

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2,095

-

$1.253

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Overview

Elevate your consumer electronics experience with the STA321MP by STMicroelectronics. Known for their top-quality manufacturing, STMicroelectronics has created a cutting-edge product that offers unparalleled value to customers. Ideal for a wide range of applications, this consumer circuit IC delivers superior performance and reliability. Say goodbye to mediocre sound quality and hello to a whole new level of audio experience with the STA321MP. Upgrade your devices today and feel the difference firsthand!

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto a circuit board, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it ideal for applications where space is limited.

Power Supplies (V): 3.3

Operating at 3.3 volts provides a balance between power consumption and performance, making it suitable for a wide range of consumer electronic devices.

No. of Terminals: 56

Having 56 terminals allows for a high level of connectivity and functionality, making the product versatile and capable of supporting complex circuit designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand elevated temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at 0 °C ensures functionality even in low-temperature environments, providing flexibility for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and good solderability, ensuring stable electrical connections and long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections on the circuit board, optimizing signal integrity and reducing electromagnetic interference.

Width: 8 mm

The compact width of 8mm enables a space-efficient design, making it suitable for applications where board real estate is limited.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature range and performance, ensuring compatibility with a wide range of consumer electronics.

Technical Specifications

Other Function Consumer ICs STA321MP attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

STA321MP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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