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STA304

STMicroelectronics

STA304 by STMicroelectronics

STA304 by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates b/w 3V and 3.6V, with a max temp of 85 °C and features a compact 10mm x 10mm square package. Ideal for various consumer electronics, it ensures reliable performance in tight spaces.

Median Price

$1.829

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,581 parts In-Stock

1+ parts

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3,581

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Digiode

USA . 3,559 parts In-Stock

1+ parts

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3,559

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Anansix

USA . 1,821 parts In-Stock

1+ parts

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1,821

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Pegasus Components GmbH

Germany . 636 parts In-Stock

1+ parts

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636

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Bristol Electronics

USA . 81 parts In-Stock

1+ parts

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100+ parts

$1.829

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81

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$1.829

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Microfarads

USA . 78 parts In-Stock

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78

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 441 parts In-Stock

1+ parts

$3.040

100+ parts

-

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$2.736

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-

441

$3.040

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$2.736

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MKK Technologies

India . 1,046 parts In-Stock

1+ parts

$5.716

100+ parts

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1,046

$5.716

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DigiPath Technology Company

USA . 1,046 parts In-Stock

1+ parts

$5.716

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1,046

$5.716

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A-Z Elektronik GmbH

Germany . 4,568 parts In-Stock

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4,568

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Corphita

USA . 3,405 parts In-Stock

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3,405

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Kepictronics

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 79 parts In-Stock

1+ parts

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$3.634

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79

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$3.634

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Overview

Elevate your projects with the STA304 from STMicroelectronics, a premier choice in consumer ICs designed to enhance performance and reliability. With its compact, low-profile design and industry-leading manufacturing standards, this versatile chip is perfect for a wide range of applications, from audio systems to smart devices. Experience seamless integration and consistent quality that empowers your innovations, ensuring you stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust protection against environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact circuit board designs, enabling efficient use of space.

Package Shape: SQUARE

The square package shape facilitates uniform placement and provides consistent performance in signal integrity.

General IC Type: CONSUMER CIRCUIT

Designed specifically as a consumer IC, this product meets the demands of high performance and reliability for consumer electronics.

Power Supplies (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with a wide range of consumer devices, optimizing power efficiency.

No. of Terminals: 44

The 44 terminals provide ample connectivity options, supporting various functionalities and simplifying integration into designs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design contributes to space-saving on PCBs while ensuring effective thermal and electrical performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in warm environments, ideal for consumer applications.

Minimum Operating Temperature: -20 °C

Operational capability at -20 °C allows versatility in diverse climatic conditions, enhancing product usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish improves reliability and ensures excellent connectivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in layout configurations, aiding in the design of compact and efficient circuits.

Maximum Seated Height: 1.6 mm

The low seated height allows for more compact designs by occupying less vertical space on the PCB.

Width: 10 mm

A width of 10 mm strikes a balance between manageability and functionality, fitting well in space-constrained applications.

Minimum Supply Voltage (Vsup): 3 V

Operating effectively at a minimum of 3V expands its compatibility with various power supplies in consumer devices.

Length: 10 mm

A uniform length of 10 mm supports standard PCB layouts, aiding in integration and reducing design complexities.

Technology: CMOS

CMOS technology enables low power consumption and high-speed performance, essential for modern consumer electronics.

Terminal Form: GULL WING

The gull wing terminal form ensures strong mechanical connection and ease of soldering, enhancing assembly reliability.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for tighter packing of components, contributing to more compact device designs.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to operate up to 3.6V provides headroom for voltage fluctuations, ensuring stability and performance.

Technical Specifications

Other Function Consumer ICs STA304 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STA304 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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