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STA320

STMicroelectronics

STA320 by STMicroelectronics

STA320 by STMicroelectronics is a compact consumer IC designed for surface mount applications. It operates b/w 3V and 3.6V, with a max temp of 85 °C and features a dual terminal layout. Ideal for audio processing in consumer electronics, it ensures reliable performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,222

-

-

-

-

Vyrian

USA . 2,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,586

-

-

-

-

Anansix

USA . 1,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 250 parts In-Stock

1+ parts

$2.624

100+ parts

-

1k+ parts

$2.361

10k+ parts

-

250

$2.624

-

$2.361

-

MKK Technologies

India . 1,965 parts In-Stock

1+ parts

$4.934

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

$4.934

-

-

-

DigiPath Technology Company

USA . 1,965 parts In-Stock

1+ parts

$4.934

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

$4.934

-

-

-

Corphita

USA . 2,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,850

-

-

-

-

Parana Technologies

USA . 1,014 parts In-Stock

1+ parts

-

100+ parts

$3.137

1k+ parts

-

10k+ parts

-

1,014

-

$3.137

-

-

Overview

Unlock unparalleled performance with the STA320 from STMicroelectronics, a leader in innovation and quality. This compact consumer IC is designed for versatility, making it ideal for a range of applications from audio to smart devices. Enjoy exceptional efficiency and reliability, backed by ST's commitment to excellence. Elevate your projects with a product that combines advanced technology and outstanding value, ensuring you stay ahead in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this IC reliable for long-term use.

Surface Mount: YES

The surface mount capability allows for easier integration onto PCBs, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape is a standard form factor that provides compatibility with various layouts, enhancing design flexibility.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is tailored for applications in everyday electronic devices, ensuring it meets the needs of typical consumer electronics.

Power Supplies (V): 3.3

Operating at 3.3V is ideal for modern electronics, optimizing power efficiency while still supporting a wide range of applications.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity options for complex functionalities without taking up too much space.

Package Style (Meter): SMALL OUTLINE

The small outline design minimizes the footprint on PCBs, making it a perfect solution for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows this IC to function effectively in various environments, making it suitable for high-temperature applications.

Minimum Operating Temperature: -20 °C

The ability to operate down to -20 °C means this IC can be used in cooler environments, expanding its applicability across different climates.

Terminal Position: DUAL

Dual terminal positioning enhances the IC’s versatility in PCB layout, allowing for easier integration in space-constrained designs.

Maximum Seated Height: 2.65 mm

With a low seated height, the IC allows for a more compact PCB design which is advantageous in tight spaces.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compact design and connectivity, making it suitable for a variety of applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures this IC can function effectively in low-power applications, enhancing energy efficiency.

Length: 17.9 mm

The length of 17.9 mm is a standard size that provides flexibility for PCB design while maintaining performance reliability.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering characteristics and reliable connections, reducing the risk of mechanical failure.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common in compact designs, facilitating high-density PCB layouts.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V accommodates a range of operational scenarios, ensuring flexibility in device design.

Technical Specifications

Other Function Consumer ICs STA320 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

STA320 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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