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STA321MPTR

STMicroelectronics

STA321MPTR by STMicroelectronics

STA321MPTR by STMicroelectronics is a 56-terminal IC with 3.3V power supply, operating from 0 to 70 °C. It features a square chip carrier package style and matte tin terminal finish. Ideal for consumer circuits, it has a very thin profile at just 1mm seated height.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,461

-

-

-

-

Digiode

USA . 2,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,705

-

-

-

-

Anansix

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,342

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,652 parts In-Stock

1+ parts

$1.479

100+ parts

-

1k+ parts

$1.331

10k+ parts

-

1,652

$1.479

-

$1.331

-

MKK Technologies

India . 56 parts In-Stock

1+ parts

$2.782

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$2.782

-

-

-

DigiPath Technology Company

USA . 56 parts In-Stock

1+ parts

$2.782

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$2.782

-

-

-

Corphita

USA . 2,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,305

-

-

-

-

Parana Technologies

USA . 375 parts In-Stock

1+ parts

-

100+ parts

$1.769

1k+ parts

-

10k+ parts

-

375

-

$1.769

-

-

Overview

Unlock the power of cutting-edge technology with the STA321MPTR by STMicroelectronics. Designed for consumer applications, this high-quality IC offers unmatched reliability and performance. With a compact square package shape and quad terminal position, it is perfect for a wide range of electronic devices. Benefit from its low power consumption, wide operating temperature range, and easy surface mount installation. Experience seamless integration and superior functionality with the STA321MPTR - your gateway to innovation.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and reducing assembly costs.

Package Shape: SQUARE

Square shape provides a compact footprint, ideal for space-constrained applications.

Power Supplies (V): 3.3

Optimal power supply voltage for efficient operation and performance.

No. of Terminals: 56

Sufficient number of terminals for versatile connectivity options and functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Low-profile package style saves space and allows for sleek design integration.

Maximum Operating Temperature: 70 °C

High operating temperature tolerance ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Wide operating temperature range enables usage in diverse temperature environments.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and enhances solderability for stable connections.

Terminal Position: QUAD

Quad terminal position offers improved stability and connectivity for the IC.

Maximum Seated Height: 1 mm

Low seated height facilitates compact design and reduces overall product size.

Width: 8 mm

Narrow width is space-efficient and allows for flexible placement on the PCB.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on components during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable solder joints and durable assembly.

Length: 8 mm

Compact length is suitable for space-constrained applications and layout designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance under typical operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and efficient PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard storage and handling procedures.

Maximum Supply Voltage (Vsup): 3.6 V

Higher maximum supply voltage support for enhanced operational flexibility and performance capabilities.

Technical Specifications

Other Function Consumer ICs STA321MPTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

STA321MPTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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