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STA321TR

STMicroelectronics

STA321TR by STMicroelectronics

STA321TR by STMicroelectronics is a consumer IC designed for surface mount applications, featuring a 64-terminal configuration and operating voltage range of 2.5V to 3.6V. It supports temperatures from 0 °C to 70°C and has a low-profile flatpack design. Ideal for various consumer electronics, it ensures reliable performance with its nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,902 parts In-Stock

1+ parts

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3,902

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Digiode

USA . 2,525 parts In-Stock

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2,525

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Anansix

USA . 827 parts In-Stock

1+ parts

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827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 459 parts In-Stock

1+ parts

$1.716

100+ parts

-

1k+ parts

$1.544

10k+ parts

-

459

$1.716

-

$1.544

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MKK Technologies

India . 1,934 parts In-Stock

1+ parts

$3.226

100+ parts

-

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1,934

$3.226

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DigiPath Technology Company

USA . 1,934 parts In-Stock

1+ parts

$3.226

100+ parts

-

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-

10k+ parts

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1,934

$3.226

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AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$15.550

100+ parts

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878

$15.550

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QUARKTWIN TECHNOLOGY LTD

USA . 25,564 parts In-Stock

1+ parts

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25,564

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Microchip USA

USA . 3,470 parts In-Stock

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3,470

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Corphita

USA . 2,088 parts In-Stock

1+ parts

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2,088

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Vigor

Singapore . 1,372 parts In-Stock

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1,372

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Parana Technologies

USA . 776 parts In-Stock

1+ parts

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100+ parts

$2.052

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776

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$2.052

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Overview

Unlock innovation with the STA321TR from STMicroelectronics—a pinnacle of quality in consumer ICs! Engineered for versatility and performance, this flatpack component seamlessly enhances your electronic applications with reliable efficiency. STMicroelectronics, a leader in semiconductor solutions, ensures top-notch manufacturing standards. Experience improved power management and compact design that elevate your projects, delivering unmatched value and long-lasting benefits!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and helps protect the internal components against environmental stress.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern circuit boards, making the product versatile for various applications.

Package Shape: SQUARE

A square package shape optimizes the layout on printed circuit boards (PCBs), ensuring efficient use of space and improved thermal management.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, this IC is tailored to meet the quality and performance standards of the consumer market.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with a wide range of low-power applications, enhancing its utility in energy-efficient designs.

No. of Terminals: 64

With 64 terminals, this IC can support complex functionalities and integrate multiple features into a single chip, promoting compact circuitry.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The low-profile and fine pitch design promotes better heat dissipation and ease of handling, suitable for high-density applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in various environments without the risk of overheating.

Minimum Operating Temperature: 0 °C

Able to operate from 0 °C ensures functionality in a broader range of environmental conditions, enhancing overall reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and reliable electrical contact, ensuring longevity of the connections.

Terminal Position: QUAD

The quad terminal position allows for flexible PCB layout options, facilitating integration in both single and multi-layer designs.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm enables slim and low-profile designs, essential for modern portable and compact devices.

Width: 10 mm

The 10 mm width is suitable for compact designs, allowing integration into space-constrained applications while maintaining robustness.

Minimum Supply Voltage (Vsup): 2.5 V

Operating down to 2.5 V increases compatibility with a variety of low-voltage systems, promoting versatility in its applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds ensures the component withstands the soldering process without compromising performance.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C assures compatibility with standard soldering techniques, enhancing production efficiency.

Length: 10 mm

The 10 mm length aligns with the width, facilitating square dimensions that are advantageous for compact PCB layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures reliable operation in typical consumer environments, suitable for everyday use.

Terminal Form: GULL WING

Gull wing terminal form provides better solder joint reliability and eases the soldering process, promoting manufacturing efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates high-density design layouts, allowing for more connections in a compact space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, guiding proper storage and handling practices to ensure device integrity.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in application design, allowing designers to choose optimal operating voltages.

Technical Specifications

Other Function Consumer ICs STA321TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

STA321TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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