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STA311BTR

STMicroelectronics

STA311BTR by STMicroelectronics

STA311BTR by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a compact 56-terminal chip carrier package. It operates within -40 °C to 90 °C and requires a nominal voltage of 3.3V. Ideal for surface mount designs, it ensures efficient thermal management with its very thin profile.

Median Price

$10.155

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 200 parts In-Stock

1+ parts

$9.910

100+ parts

$8.340

1k+ parts

$7.140

10k+ parts

-

200

$9.910

$8.340

$7.140

-

DigiKey

USA . 1,971 parts In-Stock

1+ parts

$10.400

100+ parts

$6.928

1k+ parts

$6.303

10k+ parts

-

1,971

$10.400

$6.928

$6.303

-

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,498 parts In-Stock

1+ parts

$6.888

100+ parts

-

1k+ parts

-

10k+ parts

-

4,498

$6.888

-

-

-

Vyrian

USA . 2,809 parts In-Stock

1+ parts

$7.250

100+ parts

-

1k+ parts

-

10k+ parts

-

2,809

$7.250

-

-

-

IBS Electronics

USA . 200 parts In-Stock

1+ parts

$8.970

100+ parts

$7.605

1k+ parts

$6.552

10k+ parts

-

200

$8.970

$7.605

$6.552

-

Anansix

USA . 905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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905

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,852 parts In-Stock

1+ parts

$6.525

100+ parts

-

1k+ parts

-

10k+ parts

-

2,852

$6.525

-

-

-

Component Stockers USA

USA . 2,424 parts In-Stock

1+ parts

$7.460

100+ parts

$6.450

1k+ parts

$4.890

10k+ parts

-

2,424

$7.460

$6.450

$4.890

-

IDEA Electronic Components Group

UK . 1,901 parts In-Stock

1+ parts

$7.469

100+ parts

-

1k+ parts

$6.723

10k+ parts

-

1,901

$7.469

-

$6.723

-

MKK Technologies

India . 946 parts In-Stock

1+ parts

$14.046

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$14.046

-

-

-

DigiPath Technology Company

USA . 946 parts In-Stock

1+ parts

$14.046

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$14.046

-

-

-

Vigor

Singapore . 772 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$27.000

-

-

-

Microchip USA

USA . 3,912 parts In-Stock

1+ parts

$27.048

100+ parts

-

1k+ parts

-

10k+ parts

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3,912

$27.048

-

-

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Kepictronics

USA . 8,982 parts In-Stock

1+ parts

-

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8,982

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-

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Authorized Procurement Solutions

USA . 2,870 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,870

-

-

-

-

Parana Technologies

USA . 292 parts In-Stock

1+ parts

-

100+ parts

$8.931

1k+ parts

-

10k+ parts

-

292

-

$8.931

-

-

Perfect Parts

USA . 273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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273

-

-

-

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Overview

Elevate your telecom projects with the STA311BTR from STMicroelectronics—a leader in semiconductor innovation. Designed for industrial applications, this cutting-edge IC ensures reliable performance even in extreme conditions, maximizing uptime and efficiency. Its compact design allows seamless integration into various systems, offering unmatched value. Trust in STMicroelectronics' commitment to quality, and empower your solutions with exceptional technology that drives success.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier and more efficient integration into compact electronic designs.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, making it suitable for high-density applications.

No. of Terminals: 56

With 56 terminals, this IC offers ample connectivity options for complex telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This packaging style ensures efficient thermal management while maintaining a slim profile, ideal for modern devices.

Maximum Operating Temperature: 90 °C

The ability to operate at high temperatures enhances reliability in demanding environments.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures dependable performance in extreme conditions, making it suitable for industrial applications.

Terminal Position: QUAD

Quad terminal positioning improves signal integrity and reduces parasitic effects, beneficial for high-speed applications.

Maximum Seated Height: 1 mm

The low seated height allows for design versatility and compatibility with low-profile applications.

Width: 8 mm

Compact width aids in efficient design without sacrificing performance, essential for space-constrained layouts.

Length: 8 mm

The equal length and width of the package facilitate symmetry in PCB design, simplifying layout processes.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, ensuring reliable operation in rugged and variable environments.

Terminal Form: NO LEAD

No lead terminals contribute to a low-profile design and facilitate better thermal performance.

Telecom IC Type: TELECOM CIRCUIT

Specialized for telecom applications, ensuring optimized functionality for communication systems.

Nominal Supply Voltage: 3.3 V

The standard 3.3 V supply voltage is commonly used in many applications, allowing for easy integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density connections, reducing the overall footprint of the design.

Technical Specifications

Other Function Telecom Interface ICs STA311BTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

STA311BTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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