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STA015B

STMicroelectronics

STA015B by STMicroelectronics

STA015B by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates b/w -20 °C and 85 °C, with a supply voltage range of 2.4V to 3.6V. This 64-terminal CMOS device is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,003 parts In-Stock

1+ parts

-

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4,003

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Digiode

USA . 3,073 parts In-Stock

1+ parts

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3,073

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Anansix

USA . 476 parts In-Stock

1+ parts

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476

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,272 parts In-Stock

1+ parts

$1.376

100+ parts

-

1k+ parts

$1.239

10k+ parts

-

2,272

$1.376

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$1.239

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Microchip USA

USA . 343 parts In-Stock

1+ parts

$2.311

100+ parts

-

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343

$2.311

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MKK Technologies

India . 2,327 parts In-Stock

1+ parts

$2.588

100+ parts

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2,327

$2.588

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DigiPath Technology Company

USA . 2,327 parts In-Stock

1+ parts

$2.588

100+ parts

-

1k+ parts

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2,327

$2.588

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-

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AZTECH Wire

Italy . 467 parts In-Stock

1+ parts

$20.610

100+ parts

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467

$20.610

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Vigor

Singapore . 4,568 parts In-Stock

1+ parts

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4,568

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Parana Technologies

USA . 1,893 parts In-Stock

1+ parts

-

100+ parts

$1.646

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1,893

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$1.646

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Corphita

USA . 511 parts In-Stock

1+ parts

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511

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Overview

Elevate your consumer electronics with the STA015B from STMicroelectronics, a leader in innovation and quality. This compact, low-profile IC delivers exceptional performance and reliability across diverse applications, ensuring seamless integration into your designs. With robust temperature resilience and superior build quality, the STA015B enhances efficiency and longevity, providing you with unmatched value and peace of mind for all your consumer circuit needs. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to external environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Being a surface mount device, it allows for smaller board space usage and easier integration into modern electronic designs.

Package Shape: SQUARE

The square shape of the package allows for efficient space utilization on printed circuit boards, facilitating compact designs.

General IC Type: CONSUMER CIRCUIT

This IC is specifically designed for consumer applications, ensuring optimized performance for devices like TVs, audio systems, and appliances.

No. of Terminals: 64

Having 64 terminals enables complex functionalities and higher pin-count capabilities, suitable for advanced consumer applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch grid array style allows for better thermal performance and higher density chip layouts, essential for modern electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in various consumer environments without overheating.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20 °C ensures that the IC can perform in colder climates and conditions, expanding its usability.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides excellent solderability and enhances the reliability of connections after soldering.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient heat dissipation and ease of integration into various PCB designs.

Maximum Seated Height: 1.7 mm

A maximum seated height of 1.7 mm allows for compact installation without compromising performance, particularly in space-constrained devices.

Width: 8 mm

At 8 mm wide, this IC is versatile enough to fit into different application formats while maintaining strong performance.

Minimum Supply Voltage (Vsup): 2.4 V

The ability to operate with a low minimum supply voltage makes this IC energy-efficient, suitable for battery-powered devices.

Length: 8 mm

The length of 8 mm complements the width, forming a compact package that is ideal for modern space-efficient boards.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed performance, essential for modern consumer electronics.

Terminal Form: BALL

Ball terminal form enhances reliability and stability during use, ensuring robust connections in electronic circuits.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for a denser arrangement of connections while maintaining adequate spacing for soldering.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V enables compatibility with a wide range of power sources, enhancing versatility.

Technical Specifications

Other Function Consumer ICs STA015B attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

STA015B General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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