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STA013T013TR

STMicroelectronics

STA013T013TR by STMicroelectronics

STA013T013TR by STMicroelectronics is a 44-terminal IC with power supplies of 3/3.3V, operating b/w 0-70 °C. It's a consumer circuit in a square-shaped plastic package for surface mounting applications. The technology used is CMOS, suitable for commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,302 parts In-Stock

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3,302

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Vyrian

USA . 3,188 parts In-Stock

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3,188

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Anansix

USA . 2,175 parts In-Stock

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2,175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,262 parts In-Stock

1+ parts

$2.718

100+ parts

-

1k+ parts

$2.446

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1,262

$2.718

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$2.446

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MKK Technologies

India . 1,901 parts In-Stock

1+ parts

$5.110

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1,901

$5.110

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DigiPath Technology Company

USA . 1,901 parts In-Stock

1+ parts

$5.110

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1,901

$5.110

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Vigor

Singapore . 3,414 parts In-Stock

1+ parts

$11.070

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3,414

$11.070

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AZTECH Wire

Italy . 713 parts In-Stock

1+ parts

$11.850

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713

$11.850

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QUARKTWIN TECHNOLOGY LTD

USA . 28,237 parts In-Stock

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28,237

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Lixinc

USA . 18,681 parts In-Stock

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18,681

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Microchip USA

USA . 5,533 parts In-Stock

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5,533

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Perfect Parts

USA . 5,139 parts In-Stock

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5,139

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,326 parts In-Stock

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2,326

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Parana Technologies

USA . 1,550 parts In-Stock

1+ parts

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100+ parts

$3.249

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1,550

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$3.249

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A-Z Elektronik GmbH

Germany . 400 parts In-Stock

1+ parts

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400

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GreenTree Electronics

Israel . 200 parts In-Stock

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200

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Overview

Elevate your consumer electronics with the STA013T013TR by STMicroelectronics. This cutting-edge IC offers unmatched quality and reliability from a trusted manufacturer. Ideal for a variety of applications, this product delivers exceptional value to customers seeking superior performance and efficiency. Experience the benefits of advanced technology without compromising on durability or functionality. Upgrade your devices today with the STA013T013TR and discover the difference STMicroelectronics can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for consumer electronics.

Surface Mount: YES

Being surface mountable enables easy and efficient assembly on circuit boards, reducing production time and cost.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, making it ideal for compact consumer electronic devices.

Power Supplies (V): 3/3.3

The support for 3/3.3V power supplies ensures compatibility with common voltage standards in consumer electronics.

No. of Terminals: 44

Having 44 terminals provides flexibility in connectivity options, allowing for versatile circuit design possibilities.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile design, suitable for slim and compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand typical operating conditions in consumer applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection, enhancing the ease of installation and maintenance.

Temperature Grade: COMMERCIAL

Designed for commercial use, the product meets standard performance requirements for consumer electronic applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, suitable for consumer electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and reliable solder joints, ensuring long-term durability.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for high-density mounting on PCBs, enabling compact and space-efficient designs.

Technical Specifications

Other Function Consumer ICs STA013T013TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

STA013T013TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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