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STA016A13TR

STMicroelectronics

STA016A13TR by STMicroelectronics

STA016A13TR by STMicroelectronics is a low-profile consumer IC designed for industrial applications. It operates within a voltage range of 2.25-2.75V and features a max temp of 85 °C, with 64 terminals in a compact 10x10mm package. Ideal for space-constrained designs, it utilizes CMOS technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,516 parts In-Stock

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3,516

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Vyrian

USA . 3,178 parts In-Stock

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3,178

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Anansix

USA . 2,549 parts In-Stock

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2,549

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$1.896

100+ parts

-

1k+ parts

$1.707

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-

636

$1.896

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$1.707

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MKK Technologies

India . 1,415 parts In-Stock

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$3.566

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1,415

$3.566

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DigiPath Technology Company

USA . 1,415 parts In-Stock

1+ parts

$3.566

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1,415

$3.566

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Microchip USA

USA . 263 parts In-Stock

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$38.041

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263

$38.041

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A-Z Elektronik GmbH

Germany . 7,023 parts In-Stock

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7,023

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Vigor

Singapore . 5,539 parts In-Stock

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5,539

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Corphita

USA . 4,398 parts In-Stock

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4,398

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 1,979 parts In-Stock

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1,979

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Parana Technologies

USA . 1,729 parts In-Stock

1+ parts

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$2.267

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1,729

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$2.267

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Overview

Elevate your design possibilities with the STA016A13TR from STMicroelectronics, a leader in innovative consumer IC solutions. This robust, low-profile component is engineered for excellence, offering unmatched reliability across diverse applications—from home electronics to industrial systems. With its energy-efficient operation and temperature resilience, the STA016A13TR ensures optimal performance, providing you exceptional value and peace of mind for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, enabling high-density mounting and reducing overall footprint.

Package Shape: SQUARE

The square package shape facilitates easy placement on PCBs, optimizing space usage and improving manufacturing efficiency.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, this product is specifically designed for reliability and performance in consumer applications, ensuring high-quality output.

Power Supplies (V): 2.5,3.3

Supports widely-used supply voltages of 2.5V and 3.3V, allowing compatibility with numerous electronic devices and systems.

No. of Terminals: 64

With 64 terminals, this IC offers multiple connection points for enhanced functionality and versatility in circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch flatpack style allows for a sleek design while accommodating higher pin counts, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can perform reliably in a variety of environments, from industrial to consumer settings.

Minimum Operating Temperature: -40 °C

The ability to function at a minimum temperature of -40 °C ensures performance in extreme conditions, making this IC suitable for outdoor and rugged applications.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, contributing to longer-term reliability.

Terminal Position: QUAD

Quad terminal positioning optimizes layout in circuit designs, allowing for efficient routing and compactness.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm minimizes height constraints in device designs, making it suitable for slim profiles.

Width: 10 mm

A uniform width of 10 mm provides design simplicity and compatibility with existing layout standards.

Minimum Supply Voltage (Vsup): 2.25 V

The low minimum supply voltage of 2.25V allows for energy-efficient designs, contributing to reduced power consumption.

Length: 10 mm

The 10 mm length contributes to its compact design, allowing for integration into small electronic devices seamlessly.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this product is designed for durability and reliable performance in tough conditions.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high speed, ensuring efficient performance in consumer electronics.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and offer easier PCB assembly processes due to better visibility of the solder connections.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density interconnections while maintaining manageable spacing for soldering.

Maximum Supply Voltage (Vsup): 2.75 V

With a maximum supply voltage of 2.75V, this IC can handle various power levels while ensuring safe and reliable operation.

Technical Specifications

Other Function Consumer ICs STA016A13TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

2.75 V

Minimum Supply Voltage (Vsup):

2.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STA016A13TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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