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STA014B

STMicroelectronics

STA014B by STMicroelectronics

STA014B by STMicroelectronics is a 64-terminal consumer circuit IC with power supplies of 3.3V, operating b/w -20 to 85 °C. It features a grid array package style suitable for various applications requiring low profile and fine pitch components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,867 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,867

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-

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Digiode

USA . 4,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,518

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Anansix

USA . 1,355 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,262 parts In-Stock

1+ parts

$2.730

100+ parts

-

1k+ parts

$2.457

10k+ parts

-

2,262

$2.730

-

$2.457

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MKK Technologies

India . 1,258 parts In-Stock

1+ parts

$5.133

100+ parts

-

1k+ parts

-

10k+ parts

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1,258

$5.133

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DigiPath Technology Company

USA . 1,258 parts In-Stock

1+ parts

$5.133

100+ parts

-

1k+ parts

-

10k+ parts

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1,258

$5.133

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-

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Corphita

USA . 1,626 parts In-Stock

1+ parts

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1,626

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Parana Technologies

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$3.264

1k+ parts

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10k+ parts

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168

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$3.264

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Overview

Unlock endless possibilities with the STA014B by STMicroelectronics. Designed for consumer circuits, this cutting-edge IC offers unparalleled quality and reliability. Its advanced technology ensures optimal performance in a wide range of applications. With a low profile grid array package and a ball terminal form, the STA014B delivers superior functionality while maximizing space efficiency. Experience the value and benefits of this innovative product, and take your projects to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the consumer IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards.

Package Shape: SQUARE

Square shape enables efficient use of space on the circuit board.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring reliable performance in everyday devices.

Power Supplies (V): 3.3

Operates at a standard power supply voltage, suitable for a wide range of applications.

No. of Terminals: 64

High number of terminals allow for multiple connections and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array style with low profile and fine pitch design offers space-saving benefits and efficient signal transfer.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in cold environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and connection.

Maximum Seated Height: 1.7 mm

Low seated height enables space-efficient design and integration.

Width: 8 mm

Compact width allows for flexibility in placement on the circuit board.

Minimum Supply Voltage (Vsup): 2.4 V

Low minimum supply voltage ensures compatibility with a variety of power sources.

Length: 8 mm

Short length enables further space savings on the circuit board.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form provides reliable connections and ease of soldering.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high density mounting and efficient signal routing.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage ensures compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs STA014B attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

STA014B General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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