Loading...

STA011

STMicroelectronics

STA011 by STMicroelectronics

STA011 by STMicroelectronics is a low-profile consumer IC designed for industrial applications, operating b/w -40 °C and 85°C. It features a compact 10mm x 10mm square package with 44 terminals and supports supply voltages from 2.7V to 3.3V. Ideal for surface mount technology, it ensures efficient performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 5,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,760

-

-

-

-

Digiode

USA . 3,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,075

-

-

-

-

Anansix

USA . 2,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,375

-

-

-

-

Vyrian

USA . 1,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,388

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,069 parts In-Stock

1+ parts

$3.579

100+ parts

-

1k+ parts

$3.221

10k+ parts

-

2,069

$3.579

-

$3.221

-

MKK Technologies

India . 446 parts In-Stock

1+ parts

$6.730

100+ parts

-

1k+ parts

-

10k+ parts

-

446

$6.730

-

-

-

DigiPath Technology Company

USA . 446 parts In-Stock

1+ parts

$6.730

100+ parts

-

1k+ parts

-

10k+ parts

-

446

$6.730

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Corphita

USA . 1,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

-

-

-

-

Parana Technologies

USA . 790 parts In-Stock

1+ parts

-

100+ parts

$4.279

1k+ parts

-

10k+ parts

-

790

-

$4.279

-

-

Overview

Elevate your projects with the STA011 from STMicroelectronics—a top-tier consumer IC designed for reliability and performance. Crafted with precision in a low-profile package, it seamlessly integrates into various applications, ensuring optimal efficiency under diverse temperature conditions. Trust in STMicroelectronics' renowned quality to deliver stability and innovation, empowering you to create cutting-edge solutions that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact, space-constrained designs, enhancing manufacturability.

Package Shape: SQUARE

A square package shape facilitates consistent performance and easier routing on PCB layouts, optimizing design efficiency.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring higher performance and compatibility in devices such as TVs, audio equipment, and other home electronics.

Power Supplies (V): 3

Operating at 3V allows for low-power consumption, making the IC energy-efficient and ideal for battery-operated devices.

No. of Terminals: 44

With 44 terminals, the IC provides ample connectivity options, supporting complex circuit designs and interoperability.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design minimizes space requirements and allows for slimmer device profiles, enhancing overall device aesthetics.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in demanding environments, suitable for industrial and consumer applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures ensures that the product can function in harsh conditions, extending its application range.

Terminal Position: QUAD

Quad terminal positioning improves signal integrity and routing flexibility on the PCB, contributing to enhanced overall performance.

Maximum Seated Height: 1.6 mm

A low seated height promotes better thermal management and a reduced footprint, essential for high-density designs.

Width: 10 mm

A 10 mm width supports integration into compact designs, crucial for modern electronic devices where space is at a premium.

Minimum Supply Voltage (Vsup): 2.7 V

Operational from a minimum of 2.7 V allows flexibility in power supply options, accommodating a variety of battery types.

Length: 10 mm

The 10 mm length complements the compact design, making it easy to incorporate into various applications without excessive board space.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signals high reliability and performance in challenging environments, making it suitable for demanding applications.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of bipolar and CMOS, offering high speed and low power consumption, ideal for consumer applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of soldering, ensuring robust connections on the PCB.

Maximum Supply Current: 56 mA

With a maximum supply current of 56 mA, the IC balances performance and energy efficiency, making it suitable for diverse applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for denser packing of components, maximizing design efficiency in constrained spaces.

Maximum Supply Voltage (Vsup): 3.3 V

Support for a maximum supply voltage of 3.3 V ensures compatibility with a range of power sources, enhancing design flexibility.

Technical Specifications

Other Function Consumer ICs STA011 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

56 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STA011 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19