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STA013B

STMicroelectronics

STA013B by STMicroelectronics

STA013B by STMicroelectronics is a low-profile consumer IC with a 64-terminal grid array design. It operates b/w 2.7V and 3.6V, with a max temp of 70 °C, making it ideal for compact electronic devices. Its CMOS technology ensures efficient performance in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,471 parts In-Stock

1+ parts

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3,471

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Digiode

USA . 2,767 parts In-Stock

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2,767

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Anansix

USA . 2,263 parts In-Stock

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2,263

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,606 parts In-Stock

1+ parts

$2.202

100+ parts

-

1k+ parts

$1.981

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1,606

$2.202

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$1.981

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MKK Technologies

India . 1,567 parts In-Stock

1+ parts

$4.140

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1,567

$4.140

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DigiPath Technology Company

USA . 1,567 parts In-Stock

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$4.140

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1,567

$4.140

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AZTECH Wire

Italy . 566 parts In-Stock

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$8.510

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566

$8.510

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QUARKTWIN TECHNOLOGY LTD

USA . 22,236 parts In-Stock

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22,236

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Vigor

Singapore . 7,221 parts In-Stock

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Microchip USA

USA . 5,778 parts In-Stock

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5,778

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A-Z Elektronik GmbH

Germany . 4,671 parts In-Stock

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4,671

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 965 parts In-Stock

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965

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Parana Technologies

USA . 518 parts In-Stock

1+ parts

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$2.632

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518

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$2.632

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Overview

Elevate your projects with the STA013B from STMicroelectronics, a benchmark in consumer ICs. Renowned for exceptional quality and reliability, this low-profile, surface-mount solution seamlessly integrates into various applications, enhancing performance while saving space. With its robust design and outstanding operational efficiency, the STA013B is ideal for innovative electronics—from audio devices to smart appliances—ensuring you stay ahead in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making this IC suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, which is ideal for compact consumer electronics.

Package Shape: SQUARE

The square package shape optimizes layout flexibility on PCB designs, allowing for efficient space usage.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in everyday electronic devices.

No. of Terminals: 64

A configuration of 64 terminals provides sufficient connectivity options for complex functionalities while maintaining a compact size.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile design facilitates better thermal management and space-saving, making it suitable for modern slim devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function reliably in a wide range of environments without overheating risks.

Minimum Operating Temperature: 0 °C

Allows the IC to operate effectively even in cooler conditions, expanding its application range.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances solderability and provides good electrical performance over time.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient placement on PCBs, contributing to a more compact overall design.

Maximum Seated Height: 1.7 mm

Compact seated height allows for integration into slim device profiles without compromising performance.

Width: 8 mm

A width of 8 mm strikes a balance between space efficiency and handling ease during assembly.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V means it can operate well in power-sensitive applications.

Length: 8 mm

An 8 mm length contributes to a compact design, perfect for modern consumer electronics where space is limited.

Temperature Grade: COMMERCIAL

Commercial temperature grading allows the IC to be used in standard consumer environments.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed performance, vital for consumer electronics.

Terminal Form: BALL

Ball terminal form enhances connectivity and reliability, facilitating robust solder joints.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high-density interconnections, which is efficient for compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, it can accommodate various power supply configurations while ensuring stability.

Technical Specifications

Other Function Consumer ICs STA013B attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

STA013B General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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