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STA013B13TR

STMicroelectronics

STA013B13TR by STMicroelectronics

STA013B13TR by STMicroelectronics is a low-profile consumer IC with a 64-terminal grid array design. It operates b/w 2.7V and 3.6V, with a max temp of 70 °C, making it ideal for compact electronic devices. Its CMOS technology ensures efficient performance in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,712 parts In-Stock

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4,712

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Digiode

USA . 1,912 parts In-Stock

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1,912

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Tectiva GmbH

Germany . 1,340 parts In-Stock

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1,340

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Anansix

USA . 249 parts In-Stock

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249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 347 parts In-Stock

1+ parts

$0.891

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$0.802

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347

$0.891

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$0.802

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MKK Technologies

India . 251 parts In-Stock

1+ parts

$1.675

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251

$1.675

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DigiPath Technology Company

USA . 251 parts In-Stock

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$1.675

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251

$1.675

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AZTECH Wire

Italy . 464 parts In-Stock

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$12.520

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464

$12.520

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QUARKTWIN TECHNOLOGY LTD

USA . 9,505 parts In-Stock

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9,505

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Microchip USA

USA . 5,281 parts In-Stock

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5,281

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Vigor

Singapore . 2,685 parts In-Stock

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2,685

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Parana Technologies

USA . 1,786 parts In-Stock

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$1.065

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1,786

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$1.065

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Corphita

USA . 521 parts In-Stock

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521

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Overview

Unlock unparalleled performance with the STA013B13TR from STMicroelectronics, a leader in innovative solutions. This consumer IC excels in delivering high-quality audio experiences, making it ideal for portable devices and multimedia applications. Its compact design ensures seamless integration into your projects while offering exceptional reliability and efficiency. Choose STA013B13TR for a transformative edge that elevates your products and captivates your audience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protects the circuitry from environmental factors, making it suitable for a wide range of consumer applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, contributing to compact and efficient electronic devices.

Package Shape: SQUARE

Square package shape optimizes space on the PCB, allowing for better density and layout options for devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and reliability in everyday electronic devices.

No. of Terminals: 64

A higher number of terminals enhances connectivity options and functionality, allowing for versatile applications in consumer electronics.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style enables a compact design with fine pitch, which is ideal for high-density applications where space is a premium.

Maximum Operating Temperature: 70 °C

An operational temperature limit of 70 °C ensures stability and performance in a variety of environments, thus enhancing product reliability.

Minimum Operating Temperature: 0 °C

The ability to operate down to 0 °C allows for use in colder environments, broadening the range of applications for the IC.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation and improved solderability during the manufacturing process.

Maximum Seated Height: 1.7 mm

A low seated height contributes to a slimmer profile, making it suitable for compact devices such as mobile phones and tablets.

Width: 8 mm

Compact width allows for efficient PCB layout and is conducive to high-density applications.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V allows for compatibility with a wide range of power sources, enhancing versatility.

Length: 8 mm

Standardized length ensures compatibility with existing designs and ease of integration into various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures sufficient reliability for consumer products used in typical environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered and portable devices.

Terminal Form: BALL

Ball terminal form enhances soldering performance and allows for a robust connection to the PCB, improving reliability.

Terminal Pitch: 0.8 mm

A fine terminal pitch of 0.8 mm allows for higher terminal density, supporting more complex designs without increasing the footprint.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for flexibility in power supply design, accommodating a range of voltage requirements for consumer electronics.

Technical Specifications

Other Function Consumer ICs STA013B13TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

STA013B13TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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