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ST92F150CV9TB

STMicroelectronics

ST92F150CV9TB by STMicroelectronics

ST92F150CV9TB microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5V with a max temp of 105 °C, and includes 77 I/O lines. Ideal for industrial applications, it supports CAN, I2C, and SPI connectivity. Its low-profile design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,389 parts In-Stock

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Digiode

USA . 2,196 parts In-Stock

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Anansix

USA . 962 parts In-Stock

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962

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Distributors (Availability)

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AZTECH Wire

Italy . 284 parts In-Stock

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$8.380

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284

$8.380

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Microchip USA

USA . 435 parts In-Stock

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$12.682

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435

$12.682

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IDEA Electronic Components Group

UK . 1,772 parts In-Stock

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$42.083

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$37.874

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$42.083

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$37.874

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MKK Technologies

India . 1,317 parts In-Stock

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$79.134

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DigiPath Technology Company

USA . 1,317 parts In-Stock

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$79.134

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Component Stockers USA

USA . 638 parts In-Stock

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$99.990

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$99.990

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A-Z Elektronik GmbH

Germany . 6,474 parts In-Stock

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Corphita

USA . 4,693 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Vigor

Singapore . 4,348 parts In-Stock

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Parana Technologies

USA . 535 parts In-Stock

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$50.316

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Overview

Unlock your project's potential with the ST92F150CV9TB microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for versatility and reliability, this powerful 16-bit solution excels in diverse applications, from industrial automation to consumer electronics. With a robust operating temperature range and advanced connectivity options, it ensures seamless performance and longevity, giving you the ultimate peace of mind and efficiency you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, this material ensures a reliable and long-lasting product suitable for various applications.

Surface Mount: YES

Facilitates compact designs with reduced footprint, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A flexible maximum supply voltage allows compatibility with a wide range of power sources.

Address Bus Width: 22

Provides access to a larger memory space, enhancing the microcontroller’s capability to handle complex applications.

Package Shape: SQUARE

The square shape is conducive to dense circuit design, enabling efficient use of PCB space.

Bit Size: 16

A 16-bit architecture enables efficient processing and greater precision for various calculations.

Power Supplies (V): 5

Standardized voltage supply ensures compatibility with common power systems and easy integration.

No. of Terminals: 100

A higher number of terminals allows for extensive peripheral connections, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style allows for low-profile designs, which can be advantageous in tight spaces where height is a concern.

Minimum Supply Voltage: 4.5 V

The lower end of the supply voltage range provides flexibility in power management, suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

This high-temperature threshold ensures reliable operation in demanding industrial environments.

CPU Family: ST9

The established ST9 family ensures a robust performance with a well-documented ecosystem of support.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold conditions makes it ideal for outdoor and harsh environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections for long-term operation.

ADC Channels: YES

Incorporation of ADC channels enables direct analog signal processing, enhancing versatility in applications.

DMA Channels: YES

DMA channels increase efficiency by allowing data transfer without CPU intervention, optimizing processing.

Terminal Position: QUAD

Quad terminal position improves soldering options, facilitating reliable PCB assembly.

ROM Words: 65536

A substantial ROM capacity supports complex program storage needs, enabling advanced functionalities.

Maximum Seated Height: 1.6 mm

Low seated height allows for tight packaging in electronic devices, ideal for modern compact designs.

Width: 14 mm

A compact width that aids in efficient PCB layout and design flexibility.

Data EEPROM Size: 1K

The presence of EEPROM allows for non-volatile data storage, ensuring data retention even without power.

External Data Bus Width: 8

An 8-bit data bus width provides a balanced approach to data handling, suitable for many applications.

Peripherals: DMA, TIMER(6)

Inclusion of multiple peripherals enhances the microcontroller's capabilities, making it suitable for complex tasks.

Maximum Clock Frequency: 5 MHz

5 MHz clock speed strikes a good balance between performance and power consumption for many applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring reliability and stability in challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller type, it integrates processing and I/O functionalities into a single chip, reducing design complexity.

RAM Bytes: 2048

Generous RAM size supports multiple applications and complex processing tasks without running out of memory.

Technology: HCMOS

HCMOS technology offers high speed and low power consumption, ideal for modern applications.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and reliable connections on PCBs.

Analog To Digital Converters: 16-Ch 10-Bit

Having multiple ADC channels allows for versatile analog signal processing capabilities in various applications.

Maximum Supply Current: 60 mA

Moderate supply current maintains energy efficiency, essential for battery-powered devices.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage makes integration with various components straightforward and efficient.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, enhancing the controller's motor control capabilities.

Connectivity: CAN, I2C, LIN, SCI(2), SPI

Diverse connectivity options support integration into various communication networks for enhanced performance.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updates, providing flexibility in development and deployment.

Terminal Pitch: 0.5 mm

Fine terminal pitch aids in high-density designs, accommodating more connections in a compact layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating implies a moderately high level of moisture sensitivity, suitable for controlled environments.

Speed: 24 rpm

The specified speed parameter allows for consistent control in applications requiring rotation, enhancing versatility.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient instruction processing and storage for compact applications.

No. of I/O Lines: 77

A high number of I/O lines maximizes connectivity options and peripheral interfacing capabilities.

Technical Specifications

Microcontrollers ST92F150CV9TB attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, LIN, SCI(2), SPI

Peripherals:

DMA, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92F150CV9TB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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