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ST92150JDV1QCE

STMicroelectronics

ST92150JDV1QCE by STMicroelectronics

ST92150JDV1QCE by STMicroelectronics is a 16-bit microcontroller with 22-bit address bus width, 8-bit on-chip data RAM, and 131072 ROM words. It features 7 external interrupts, ADC channels, and DMA channels. Ideal for applications requiring low power mode, it offers connectivity options like CAN(2), I2C, SCI(2), SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,232 parts In-Stock

1+ parts

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2,232

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Vyrian

USA . 1,473 parts In-Stock

1+ parts

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1,473

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Anansix

USA . 1,104 parts In-Stock

1+ parts

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1,104

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,106 parts In-Stock

1+ parts

$29.699

100+ parts

-

1k+ parts

$26.729

10k+ parts

-

2,106

$29.699

-

$26.729

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MKK Technologies

India . 2,223 parts In-Stock

1+ parts

$55.848

100+ parts

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2,223

$55.848

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DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$55.848

100+ parts

-

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10k+ parts

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2,223

$55.848

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Corphita

USA . 4,937 parts In-Stock

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4,937

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Parana Technologies

USA . 2,072 parts In-Stock

1+ parts

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100+ parts

$35.510

1k+ parts

-

10k+ parts

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2,072

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$35.510

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Overview

Experience the power and precision of the ST92150JDV1QCE microcontroller by STMicroelectronics, a leader in cutting-edge technology. With its advanced features and innovative design, this versatile microcontroller is perfect for a wide range of applications. Whether you're working on industrial automation, automotive systems, or consumer electronics, this product offers unmatched performance, reliability, and flexibility. Trust STMicroelectronics to deliver quality products that exceed your expectations and take your projects to the next level. Elevate your designs with the ST92150JDV1QCE microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller against environmental factors, making it durable for various applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options while ensuring the device operates within safe voltage limits.

Address Bus Width: 22

This wide address bus allows for a larger memory address space, enabling the microcontroller to handle more data and instructions.

Bit Size: 16

A 16-bit architecture provides improved performance and processing capabilities compared to lower bit sizes, making it suitable for complex tasks.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options for peripherals and external devices, increasing the versatility of the microcontroller.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain stable performance.

No. of Timers: 5

Multiple timers allow for precise timing control in various applications, enhancing the functionality and versatility of the microcontroller.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller IC ensures optimized performance and efficiency for embedded applications, making it a reliable choice.

ROM Programmability: FLASH

Flash ROM technology allows for convenient and flexible programming of the microcontroller, making firmware updates and modifications easier to implement.

Technical Specifications

Microcontrollers ST92150JDV1QCE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

NO

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

Low Power Mode:

YES

No. of External Interrupts:

7

No. of I/O Lines:

80

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN(2), I2C, SCI(2), SPI

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92150JDV1QCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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