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ST92150CV1QCE

STMicroelectronics

ST92150CV1QCE by STMicroelectronics

ST92150CV1QCE by STMicroelectronics is a 16-bit microcontroller with 22-bit address bus width, 131072 ROM words, and 6144 RAM bytes. It features 16-Ch 10-Bit ADC channels, CAN/I2C/SCI(2)/SPI connectivity, and low power mode. Ideal for applications requiring high-speed processing and multiple I/O lines in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,805

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-

-

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Anansix

USA . 2,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,227

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-

-

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Digiode

USA . 1,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,939

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,167 parts In-Stock

1+ parts

$22.193

100+ parts

-

1k+ parts

$19.974

10k+ parts

-

2,167

$22.193

-

$19.974

-

MKK Technologies

India . 1,384 parts In-Stock

1+ parts

$41.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,384

$41.733

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-

-

DigiPath Technology Company

USA . 1,384 parts In-Stock

1+ parts

$41.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,384

$41.733

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-

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Corphita

USA . 1,009 parts In-Stock

1+ parts

-

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1k+ parts

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1,009

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-

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Parana Technologies

USA . 982 parts In-Stock

1+ parts

-

100+ parts

$26.535

1k+ parts

-

10k+ parts

-

982

-

$26.535

-

-

Overview

Discover the cutting-edge ST92150CV1QCE microcontroller by STMicroelectronics, a leader in innovative electronics. With a wide range of applications and high-quality manufacturing, this product offers unparalleled value to customers seeking top-notch performance and reliability. Experience the benefits of advanced features like ADC channels, DMA channels, and PWM channels, all packed into a compact package that delivers exceptional results. Upgrade your projects with the ST92150CV1QCE and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatile power options and compatibility with a wide range of systems.

Address Bus Width: 22

The wide address bus width enables efficient access to memory locations and data processing capabilities.

Bit Size: 16

The 16-bit architecture allows for enhanced processing power and performance compared to lower bit sizes.

No. of Terminals: 100

The ample number of terminals provides flexibility for connecting various external components and peripherals.

No. of Timers: 5

Having multiple timers allows for precise timing control and coordination of tasks within the microcontroller.

RAM Bytes: 6144

With a large RAM size, the microcontroller can handle complex data processing tasks and store temporary information efficiently.

ADC Channels: YES

The presence of Analog-to-Digital Converters (ADC) enables the microcontroller to interface with analog sensors and inputs, expanding its functionality.

Connectivity: CAN, I2C, SCI(2), SPI

Support for various communication protocols like CAN, I2C, SCI, and SPI allows for seamless integration with different devices and systems.

Low Power Mode: YES

The availability of a low power mode helps in conserving energy and prolonging battery life in applications where power efficiency is crucial.

Technical Specifications

Microcontrollers ST92150CV1QCE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

NO

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

Low Power Mode:

YES

No. of External Interrupts:

7

No. of I/O Lines:

80

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, SCI(2), SPI

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92150CV1QCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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