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ST92F150JDV1QC

STMicroelectronics

ST92F150JDV1QC by STMicroelectronics

STMicroelectronics ST92F150JDV1QC microcontroller features 16-bit CPU with 22-bit address bus, 131072 ROM words, and 6144 RAM bytes. Ideal for automotive applications, it offers 16-Ch ADC, CAN(2), I2C, LIN connectivity, and operates at up to 5 MHz clock frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Anansix

USA . 1,953 parts In-Stock

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Vyrian

USA . 547 parts In-Stock

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Digiode

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Nova Conductors

Japan . 31 parts In-Stock

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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Q Components

USA . 11 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 897 parts In-Stock

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$9.358

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897

$9.358

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Ampacity Inc.

Singapore . 1,112 parts In-Stock

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$14.000

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$14.000

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Aztec Data Supply Inc.

USA . 1,544 parts In-Stock

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$29.745

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$29.745

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Corohmni

South Africa . 171 parts In-Stock

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$49.218

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IDEA Electronic Components Group

UK . 2,000 parts In-Stock

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$73.243

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$65.919

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MKK Technologies

India . 321 parts In-Stock

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$137.729

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DigiPath Technology Company

USA . 321 parts In-Stock

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$137.729

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Continental Prestige Electronics

USA . 5,783 parts In-Stock

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Metaverse IC Inc.

Canada . 5,163 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,468 parts In-Stock

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Corphita

USA . 2,122 parts In-Stock

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Parana Technologies

USA . 1,297 parts In-Stock

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$87.573

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A-Z Elektronik GmbH

Germany . 993 parts In-Stock

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Lixinc

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Aranea Global

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Overview

Unleash the power of innovation with the ST92F150JDV1QC microcontroller by STMicroelectronics. Crafted with precision and expertise, this device is designed to meet the highest standards of quality and reliability. Ideal for a wide range of applications, from automotive systems to industrial controls, this microcontroller offers unmatched value and performance. With advanced features such as ADC channels, DMA support, and PWM capabilities, customers can experience seamless connectivity and efficient operation. Elevate your projects to new heights with the ST92F150JDV1QC microcontroller - where excellence meets possibility.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

Can handle a higher voltage range to provide flexibility in power supply options.

Address Bus Width: 22

Wide address bus allows for efficient memory addressing and data manipulation.

Package Shape: RECTANGULAR

Rectangular shape is easy to handle and fit onto the PCB.

Bit Size: 16

16-bit architecture allows for faster processing and higher data precision.

Power Supplies (V): 5

Standard voltage supply for compatibility with various power sources.

No. of Terminals: 100

Sufficient number of terminals for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style is compact and easy to integrate into electronic devices.

Minimum Supply Voltage: 4.5 V

Can operate at a lower voltage for power efficiency and extended battery life.

Maximum Operating Temperature: 125 °C

High operating temperature range makes it suitable for automotive and industrial environments.

CPU Family: ST9

Part of a reliable and proven CPU family known for performance and stability.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments and outdoor conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated analog-to-digital converters enable sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access channels improve data transfer speed and efficiency.

Terminal Position: QUAD

Quad terminal layout facilitates easier PCB routing and design.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 3.4 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact width for fitting into tight spaces or small devices.

Data EEPROM Size: 1K

EEPROM memory for non-volatile data storage and retention.

External Data Bus Width: 8

Efficient data transfer with wide external data bus.

Peripherals: DMA, TIMER(6)

Multiple peripherals for enhanced functionality and external device communication.

Maximum Clock Frequency: 5 MHz

High clock frequency for fast processing and real-time operation.

Length: 20 mm

Optimal length for balance between compact size and functionality.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature and environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral circuits for reduced external component count and simplified design.

RAM Bytes: 6144

Generous RAM capacity for data storage and processing tasks.

Technology: HCMOS

High-speed CMOS technology for efficient digital signal processing.

Terminal Form: GULL WING

Gull wing terminals for secure soldering and reliable connections.

Analog To Digital Convertors: 16-Ch 10-Bit

High-resolution ADCs for accurate analog signal conversion.

Maximum Supply Current: 60 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Stable nominal voltage supply for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for precise control of motor speed and power output.

Connectivity: CAN(2), I2C, LIN, SCI(2), SPI

Versatile connectivity options for interfacing with a wide range of devices and protocols.

ROM Programmability: FLASH

Flash programmable memory for easy firmware updates and reprogramming.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact PCB layout and space-saving designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for extended storage and handling flexibility.

Speed: 24 rpm

Allows for fast data processing and real-time control applications.

On Chip Program ROM Width: 8

On-chip program ROM with wide data path for efficient program execution.

No. of I/O Lines: 77

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers ST92F150JDV1QC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN(2), I2C, LIN, SCI(2), SPI

Peripherals:

DMA, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92F150JDV1QC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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