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ST92124V1TCE

STMicroelectronics

ST92124V1TCE by STMicroelectronics

ST92124V1TCE by STMicroelectronics is a 16-bit microcontroller with 22-bit address bus width, 5 MHz clock frequency, and 131072 ROM words. It is ideal for applications requiring low power mode, featuring 77 I/O lines, and connectivity options like I2C, SCI(2), SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,971

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-

-

Anansix

USA . 2,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

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-

-

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Digiode

USA . 1,692 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,692

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$24.824

100+ parts

-

1k+ parts

$22.342

10k+ parts

-

2,263

$24.824

-

$22.342

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MKK Technologies

India . 2,030 parts In-Stock

1+ parts

$46.681

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

$46.681

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-

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DigiPath Technology Company

USA . 2,030 parts In-Stock

1+ parts

$46.681

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

$46.681

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-

-

Parana Technologies

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

$29.681

1k+ parts

-

10k+ parts

-

1,680

-

$29.681

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Corphita

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,262

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Overview

Unleash the power of cutting-edge technology with the ST92124V1TCE microcontroller by STMicroelectronics. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, efficiency, and innovation. Elevate your projects to new heights with the ST92124V1TCE and experience the advantage of superior engineering and advanced features that set it apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the microcontroller lightweight and durable, making it suitable for various applications without compromising on strength.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage allows for flexibility in power input options, making the microcontroller compatible with a wide range of power sources.

Package Shape: SQUARE

The square package shape provides easy mounting and integration into circuit boards, ensuring efficient use of space in electronic devices.

Bit Size: 16

With a 16-bit architecture, this microcontroller offers enhanced processing capabilities and can handle complex algorithms and tasks efficiently.

ADC Channels: YES

The inclusion of ADC channels allows for analog signals to be converted to digital data, enabling the microcontroller to interface with sensors and other analog peripherals.

No. of Timers: 5

Having multiple timers enhances the microcontroller's ability to perform time-sensitive tasks, schedule events, and manage various functions simultaneously.

ROM Programmability: FLASH

The flash ROM programmability feature enables easy and quick updates to the microcontroller's firmware, ensuring flexibility and adaptability for future enhancements.

Connectivity: I2C, SCI(2), SPI

Support for various communication protocols like I2C, SCI, and SPI enables seamless integration with other devices, expanding the microcontroller's connectivity options.

Low Power Mode: YES

The low power mode capability allows the microcontroller to conserve energy and extend battery life in portable devices or power-efficient applications.

Technical Specifications

Microcontrollers ST92124V1TCE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

NO

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of External Interrupts:

7

No. of I/O Lines:

77

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SCI(2), SPI

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92124V1TCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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