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ST92150CR9TCE

STMicroelectronics

ST92150CR9TCE by STMicroelectronics

ST92150CR9TCE by STMicroelectronics is a 16-bit microcontroller with 2048 bytes of RAM and 1K data EEPROM. It features 5 MHz clock frequency, 7 external interrupts, and 16-channel 10-bit ADC for applications in TIMER(5), WDT peripherals, CAN, I2C, SCI, SPI connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,212

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Vyrian

USA . 2,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,971

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Anansix

USA . 2,493 parts In-Stock

1+ parts

-

100+ parts

-

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2,493

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,145 parts In-Stock

1+ parts

$33.895

100+ parts

-

1k+ parts

$30.505

10k+ parts

-

2,145

$33.895

-

$30.505

-

MKK Technologies

India . 2,111 parts In-Stock

1+ parts

$63.737

100+ parts

-

1k+ parts

-

10k+ parts

-

2,111

$63.737

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-

-

DigiPath Technology Company

USA . 2,111 parts In-Stock

1+ parts

$63.737

100+ parts

-

1k+ parts

-

10k+ parts

-

2,111

$63.737

-

-

-

Corphita

USA . 3,479 parts In-Stock

1+ parts

-

100+ parts

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3,479

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-

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Parana Technologies

USA . 116 parts In-Stock

1+ parts

-

100+ parts

$40.526

1k+ parts

-

10k+ parts

-

116

-

$40.526

-

-

Overview

Get ready to experience unmatched performance and reliability with the ST92150CR9TCE microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering seamless connectivity and efficient operation. Unlock endless possibilities with the ST92150CR9TCE and discover the value it brings to your projects. Experience innovation at its finest with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection against environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Operating at a maximum supply voltage of 5.5V provides flexibility in power supply options without risking damage to the device.

No. of Terminals: 64

With 64 terminals, this microcontroller can support a wide range of inputs and outputs, enabling more complex and versatile applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance even in extreme environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels allow for the conversion of analog signals into digital data, expanding the range of inputs the microcontroller can process.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

ROM Words: 65536

The large ROM size of 65536 words provides ample memory for storing program instructions and data, accommodating complex algorithms and applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates a variety of peripherals and functions into a single chip, simplifying design and reducing component count.

Connectivity: CAN, I2C, SCI, SPI

Support for multiple communication interfaces such as CAN, I2C, SCI, and SPI allows for seamless connectivity with other devices and systems, enhancing versatility.

Technical Specifications

Microcontrollers ST92150CR9TCE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Low Power Mode:

YES

No. of External Interrupts:

7

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, SCI, SPI

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92150CR9TCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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