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ST92150CV9TBE

STMicroelectronics

ST92150CV9TBE by STMicroelectronics

ST92150CV9TBE by STMicroelectronics is a 16-bit microcontroller with 22-bit address bus width, 2048 bytes of RAM, and 1K data EEPROM size. It features 5 MHz max clock frequency, CAN/I2C/SCI/SPI connectivity, and low power mode. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,759 parts In-Stock

1+ parts

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3,759

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Digiode

USA . 2,702 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,702

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Anansix

USA . 424 parts In-Stock

1+ parts

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100+ parts

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424

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 936 parts In-Stock

1+ parts

$34.456

100+ parts

-

1k+ parts

$31.010

10k+ parts

-

936

$34.456

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$31.010

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MKK Technologies

India . 418 parts In-Stock

1+ parts

$64.792

100+ parts

-

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10k+ parts

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418

$64.792

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DigiPath Technology Company

USA . 418 parts In-Stock

1+ parts

$64.792

100+ parts

-

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418

$64.792

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Corphita

USA . 2,977 parts In-Stock

1+ parts

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2,977

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Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

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100+ parts

$41.197

1k+ parts

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2,188

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$41.197

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Overview

Unlock endless possibilities with the ST92150CV9TBE microcontroller by STMicroelectronics. With a solid reputation for quality and innovation, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. This versatile microcontroller offers value, benefits, and advantages that cater to your unique needs. From its low power mode to its extensive peripherals and connectivity options, this product is designed to exceed your expectations. Experience seamless integration and superior performance with the ST92150CV9TBE microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space during production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage enables flexibility in power input options, accommodating a wide range of applications.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for fast and efficient data processing, enhancing overall performance.

Address Bus Width: 22

The wide address bus width enables access to a large memory space, supporting complex computations and data storage.

Package Shape: SQUARE

The square package shape offers efficient use of space on circuit boards, optimizing layout and component placement.

Bit Size: 16

The 16-bit architecture allows for handling larger data chunks at once, improving processing speed and efficiency.

No. of Terminals: 100

Having a high number of terminals provides connectivity options for various peripherals and external devices, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and facilitates compact designs for portable applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in system integration.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the product suitable for industrial and automotive applications, where temperature variations are common.

CPU Family: ST9

Belonging to the ST9 CPU family indicates reliable performance and compatibility with existing systems and software, making it a trusted choice for developers.

No. of External Interrupts: 7

Having multiple external interrupts allows the microcontroller to respond quickly to external events, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the product can function reliably in cold environments, making it suitable for outdoor and automotive applications.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and devices, expanding its range of applications.

DMA Channels: YES

Direct Memory Access (DMA) channels provide efficient data transfer between memory and peripherals, reducing CPU workload and improving overall performance.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity options and facilitates easy integration with external components, simplifying system design.

ROM Words: 65536

The large ROM capacity allows for storing a significant amount of program code and data, supporting complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for space-constrained designs and compact electronic devices.

Width: 14 mm

The compact width of the microcontroller enables it to fit in small form factor devices, contributing to space-efficient design solutions.

Data EEPROM Size: 1K

The 1K EEPROM size provides non-volatile memory storage for critical data, ensuring data integrity even during power loss or system shutdown.

External Data Bus Width: 8

The wide external data bus width allows for fast data transfer between the microcontroller and external memory devices, enhancing overall system performance.

Peripherals: TIMER(5), WDT

The presence of multiple timers and a Watchdog Timer (WDT) enhances the microcontroller's ability to manage time-critical tasks and ensure system reliability.

Maximum Clock Frequency: 5 MHz

The high maximum clock frequency supports fast data processing and execution speed, making the microcontroller suitable for time-sensitive applications.

Length: 14 mm

The compact length of the microcontroller complements its width and seated height, providing a small footprint for integration in portable and embedded systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller enables the product to perform a wide range of functions, including processing, control, and interfacing, making it a versatile solution for diverse applications.

No. of Timers: 5

Having multiple timers allows the microcontroller to manage various timing operations simultaneously, enhancing system efficiency and accuracy.

RAM Bytes: 2048

The 2048 bytes of RAM provide temporary storage for data and variables during program execution, supporting multitasking and data processing capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates soldering and component mounting on PCBs, ensuring secure connections and robust assembly in electronic devices.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel, 10-bit Analog to Digital Converters (ADC) enable the microcontroller to interface with multiple analog signals and accurately convert them to digital data for processing.

Maximum Supply Current: 60 mA

The low maximum supply current consumption indicates energy efficiency, prolonging battery life and reducing overall power consumption in portable and battery-operated devices.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in electronic systems, ensuring compatibility with existing components and power sources.

No. of Serial I/Os: 3

Having multiple Serial Input/Output (I/O) ports enables communication with external devices and peripherals, expanding connectivity options and data exchange capabilities.

PWM Channels: YES

The Pulse Width Modulation (PWM) channels allow the microcontroller to generate analog voltage levels for controlling motors, LEDs, and other devices, offering precise and efficient output control.

Connectivity: CAN, I2C, SCI(2), SPI

Support for Controller Area Network (CAN), Inter-Integrated Circuit (I2C), Serial Communication Interface (SCI), and Serial Peripheral Interface (SPI) enhances the microcontroller's communication capabilities, enabling seamless integration with a wide range of devices and networks.

ROM Programmability: FLASH

The Flash programmability of ROM allows for easy and quick updates to the program code, enabling firmware upgrades and customization without the need for external programming tools.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm provides high-density mounting capabilities, allowing for compact and miniaturized designs in space-constrained applications.

Format: FIXED POINT

The fixed-point format for data representation simplifies mathematical calculations and improves computational accuracy, making the microcontroller suitable for precision control applications.

Speed: 24 rpm

The 24 revolutions per minute (rpm) speed specification indicates the rotational speed capability of the microcontroller for motor control applications, ensuring precise and efficient motor performance.

Low Power Mode: YES

The low power mode feature allows the microcontroller to minimize power consumption during idle or standby periods, prolonging battery life and enhancing energy efficiency in battery-operated devices.

On Chip Program ROM Width: 8

The wide on-chip program ROM width enables storing a significant amount of program code directly on the microcontroller, reducing external memory requirements and simplifying system design.

No. of I/O Lines: 77

Having a

Technical Specifications

Microcontrollers ST92150CV9TBE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

NO

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of External Interrupts:

7

No. of I/O Lines:

77

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, SCI(2), SPI

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92150CV9TBE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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