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ST92F150CV1QBE

STMicroelectronics

ST92F150CV1QBE by STMicroelectronics

STMicroelectronics ST92F150CV1QBE is a 16-bit microcontroller with 22-bit address bus width, operating at up to 5 MHz. Ideal for industrial applications, it features 131072 ROM words, 6144 RAM bytes, and offers ADC and DMA channels for efficient data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,707 parts In-Stock

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2,707

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Anansix

USA . 1,823 parts In-Stock

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1,823

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Vyrian

USA . 713 parts In-Stock

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713

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Nova Conductors

Japan . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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9

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ComSIT USA

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$5.137

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324

$5.137

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Corohmni

South Africa . 21 parts In-Stock

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$18.751

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21

$18.751

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Ampacity Inc.

Singapore . 804 parts In-Stock

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$22.000

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804

$22.000

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Aztec Data Supply Inc.

USA . 3,375 parts In-Stock

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$37.012

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$37.012

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

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$45.433

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$40.890

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1,096

$45.433

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$40.890

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MKK Technologies

India . 2,263 parts In-Stock

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$85.434

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2,263

$85.434

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DigiPath Technology Company

USA . 2,263 parts In-Stock

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$85.434

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2,263

$85.434

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Component Stockers USA

USA . 567 parts In-Stock

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$99.990

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Argo Parts USA

USA . 4,668 parts In-Stock

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Continental Prestige Electronics

USA . 3,611 parts In-Stock

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Corphita

USA . 3,456 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,090 parts In-Stock

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$54.322

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2,090

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$54.322

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Elevate your projects with the ST92F150CV1QBE microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers top-notch performance and reliability in every component they produce. This versatile microcontroller is perfect for a wide range of applications, offering customers value through its advanced features and benefits. Whether you're looking to enhance your industrial automation systems or develop cutting-edge consumer electronics, the ST92F150CV1QBE provides the power and efficiency you need to bring your ideas to life. Choose STMicroelectronics for quality you can trust and innovation you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a variety of power sources.

Address Bus Width: 22

A wide address bus width allows for efficient data handling and processing.

Package Shape: RECTANGULAR

The rectangular shape is standard and fits well on PCB layouts.

Bit Size: 16

A 16-bit architecture provides sufficient processing power for many applications.

Power Supplies (V): 5

The 5V power supply is commonly available and easy to work with.

No. of Terminals: 100

A high number of terminals allow for a wide range of connection options.

Package Style (Meter): FLATPACK

The flatpack style saves space and is suitable for compact designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures flexibility in power requirements.

Maximum Operating Temperature: 105 °C

The high operating temperature range makes the product suitable for industrial environments.

CPU Family: ST9

The ST9 CPU family is known for its reliability and performance.

Minimum Operating Temperature: -40 °C

The product can operate in very cold temperatures, making it suitable for a variety of environments.

ADC Channels: YES

Analog-to-digital converter channels allow for easy interfacing with analog sensors and devices.

DMA Channels: YES

Direct memory access channels enable fast and efficient data transfers.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection.

ROM Words: 131072

The large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height: 3.4 mm

The low seated height is suitable for slim and compact device designs.

Width: 14 mm

The compact width allows for easy integration into various applications.

External Data Bus Width: 8

The 8-bit data bus width allows for efficient data transfer and processing.

Maximum Clock Frequency: 5 MHz

The high clock frequency helps in achieving fast data processing and response times.

Length: 20 mm

The product has a moderate length, suitable for various PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and processing capabilities into a single chip.

RAM Bytes: 6144

The generous RAM size allows for efficient data storage and manipulation.

Technology: HCMOS

HCMOS technology offers a good balance between speed, power consumption, and ease of integration.

Terminal Form: GULL WING

Gull wing terminals are sturdy and suitable for automated assembly processes.

Maximum Supply Current: 60 mA

The low supply current ensures energy efficiency in various applications.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage is a standard and widely available power source.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of outputs such as motor speed and LED brightness.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the firmware.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact design and high-density PCB layouts.

Speed: 24 rpm

The product can operate at a speed of 24 rotations per minute, suitable for various motor control applications.

No. of I/O Lines: 77

The high number of I/O lines provide ample connectivity options for interfacing with external devices.

Technical Specifications

Microcontrollers ST92F150CV1QBE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e3

Length:

20 mm

No. of I/O Lines:

77

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST92F150CV1QBE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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