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ST90R158Q6

STMicroelectronics

ST90R158Q6 by STMicroelectronics

ST90R158Q6 by STMicroelectronics is a 16-bit microcontroller with 16-bit address bus width and external data bus width of 8. It operates at a max clock frequency of 5 MHz, suitable for industrial applications requiring high-speed processing and control. With features like ADC channels, DMA channels, and PWM channels, it offers versatile functionality in automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,126 parts In-Stock

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8,126

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Digiode

USA . 4,328 parts In-Stock

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4,328

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Anansix

USA . 891 parts In-Stock

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891

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LittleDiode

UK . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$10.010

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48

$10.010

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IDEA Electronic Components Group

UK . 40 parts In-Stock

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$34.293

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-

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$30.864

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40

$34.293

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$30.864

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$40.209

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354

$40.209

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MKK Technologies

India . 558 parts In-Stock

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$64.486

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558

$64.486

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$64.486

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558

$64.486

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 2,343 parts In-Stock

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$41.002

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2,343

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$41.002

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Corphita

USA . 1,770 parts In-Stock

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1,770

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Overview

Unleash the power of innovation with the ST90R158Q6 microcontroller from STMicroelectronics! Designed with precision and reliability, this versatile product offers a wide range of applications for various industries. With advanced technology and exceptional performance, this microcontroller provides customers with unparalleled value, benefits, and advantages. Trust in the quality and expertise of STMicroelectronics to bring your projects to life with the ST90R158Q6. Choose excellence, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package ensures easy handling and durability of the microcontroller.

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Address Bus Width: 16

Wide address bus allows for addressing a large memory space, essential for complex applications.

Package Shape: RECTANGULAR

Standard rectangular shape facilitates assembly and fitting into standard PCB layouts.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and performance for applications.

Power Supplies (V): 3/5

Supports multiple power supply options, allowing compatibility with various system configurations.

No. of Terminals: 80

Sufficient number of terminals for connecting external components and peripherals, enhancing versatility.

Package Style (Meter): FLATPACK

Flatpack design saves space and provides a low-profile package, ideal for compact designs.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, maximizing energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

CPU Family: ST9

Part of a reputable CPU family known for reliability and performance, ensuring quality.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold conditions makes it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Integrated ADC channels enable analog to digital conversion, essential for sensor interfacing and data acquisition.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, reducing CPU workload and improving system performance.

Terminal Position: QUAD

Quad terminal layout simplifies PCB routing and connection, enhancing ease of use and assembly.

Maximum Seated Height: 3.4 mm

Low seated height allows for slim and compact designs, suitable for space-constrained applications.

Width: 14 mm

Compact width dimensions enable space-saving integration into tight PCB layouts.

External Data Bus Width: 8

8-bit external data bus width ensures compatibility with various peripherals and memory devices.

Maximum Clock Frequency: 5 MHz

High clock frequency capability allows for fast processing and responsive performance in real-time applications.

Length: 20 mm

Optimal length dimensions for fitting into standard PCB sizes, facilitating easy integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, offering tailored features and capabilities for embedded applications.

RAM Bytes: 2048

Ample RAM capacity for data storage and manipulation, supporting complex algorithms and multitasking.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form offers robust mechanical support and easy soldering during assembly.

Maximum Supply Current: 40 mA

Low supply current requirement helps conserve energy and reduce overall power consumption.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage ensures compatibility with common power sources and components.

PWM Channels: YES

Integrated PWM channels allow for precise control of motor speeds and analog outputs.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting, suitable for compact PCB designs.

Speed: 24 rpm

Operational speed of 24 rpm provides sufficient processing power for a wide range of applications.

No. of I/O Lines: 67

Abundance of I/O lines for connecting peripherals and interfacing with external devices, enhancing versatility.

Technical Specifications

Microcontrollers ST90R158Q6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 TO 5.5V SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G80

JESD-609 Code:

e4

Length:

20 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

2048

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90R158Q6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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