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ST90135M5T6

STMicroelectronics

ST90135M5T6 by STMicroelectronics

ST90135M5T6 by STMicroelectronics is a 16-bit microcontroller with 80 terminals, operating at up to 5.5V. It features ADC and DMA channels, with ROM of 24576 words and RAM of 768 bytes. Ideal for industrial applications requiring a low-profile package style and a max clock frequency of 5MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,021 parts In-Stock

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Digiode

USA . 1,193 parts In-Stock

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1,193

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Vyrian

USA . 492 parts In-Stock

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492

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 583 parts In-Stock

1+ parts

$55.421

100+ parts

-

1k+ parts

$49.879

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583

$55.421

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$49.879

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MKK Technologies

India . 1,501 parts In-Stock

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$104.215

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$104.215

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DigiPath Technology Company

USA . 1,501 parts In-Stock

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$104.215

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1,501

$104.215

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Corphita

USA . 2,038 parts In-Stock

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2,038

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Parana Technologies

USA . 1,721 parts In-Stock

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$66.264

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1,721

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$66.264

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Overview

Unleash the power of innovation with the ST90135M5T6 microcontroller from STMicroelectronics. Packed with cutting-edge technology, this device offers unmatched quality and reliability. Whether you're designing industrial automation systems, consumer electronics, or automotive applications, this microcontroller delivers superior performance and efficiency. Trust in STMicroelectronics' expertise to bring your ideas to life with the ST90135M5T6, a game-changer in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher power requirements and operate reliably within this voltage range.

Address Bus Width: 16

A wider address bus width of 16 bits allows for a larger memory address space, enabling the microcontroller to access and process more data efficiently.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on circuit boards and making it easier to integrate into various electronic devices.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle larger data chunks and perform more complex operations, suitable for a wide range of applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies offers flexibility in design and compatibility with different voltage requirements, making it versatile for various projects.

No. of Terminals: 80

Having 80 terminals allows for a greater number of connections and interfaces, enabling the microcontroller to interact with multiple external devices and peripherals.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures stable operation even under lower power conditions, providing reliability and consistent performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the microcontroller to withstand elevated temperatures in industrial environments, ensuring reliable operation under harsh conditions.

Technical Specifications

Microcontrollers ST90135M5T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

24576

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90135M5T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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