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ST90135M6Q6

STMicroelectronics

ST90135M6Q6 by STMicroelectronics

ST90135M6Q6 by STMicroelectronics is a 16-bit microcontroller with 3/5V power supplies, 1024 bytes RAM, and 32768 ROM words. It features ADC and DMA channels, suitable for industrial applications requiring a max clock frequency of 5MHz. The package style is flatpack with a rectangular shape, making it ideal for compact designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,100 parts In-Stock

1+ parts

-

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4,100

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Vyrian

USA . 2,832 parts In-Stock

1+ parts

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1k+ parts

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2,832

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Anansix

USA . 987 parts In-Stock

1+ parts

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987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,258 parts In-Stock

1+ parts

$78.134

100+ parts

-

1k+ parts

$70.320

10k+ parts

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1,258

$78.134

-

$70.320

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MKK Technologies

India . 953 parts In-Stock

1+ parts

$146.925

100+ parts

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953

$146.925

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DigiPath Technology Company

USA . 953 parts In-Stock

1+ parts

$146.925

100+ parts

-

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953

$146.925

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Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

-

100+ parts

$93.421

1k+ parts

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1,017

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$93.421

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Corphita

USA . 856 parts In-Stock

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856

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Overview

Unlock the power of innovation with the ST90135M6Q6 microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this high-quality product offers unparalleled performance for a wide range of applications. From smart appliances to industrial automation, this versatile microcontroller delivers exceptional value, efficiency, and flexibility. Trust in STMicroelectronics' reputation for excellence and elevate your projects to new heights with the ST90135M6Q6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easier integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 16

A wider address bus allows for larger memory addressability and more efficient data handling.

Bit Size: 16

The 16-bit architecture enables faster processing speed and more complex operations compared to 8-bit microcontrollers.

Power Supplies (V): 3/5

Supports multiple power supply options, offering flexibility and compatibility with various power sources.

No. of Terminals: 80

A higher number of terminals provide more connectivity options and interfaces for peripherals, expanding the microcontroller's capabilities.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold conditions without compromising performance.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency and offloads the CPU for improved system performance.

ROM Words: 32768

Large ROM capacity allows for storing program code and data, increasing the versatility and functionality of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller with various integrated peripherals, offering a complete solution for embedded system designs.

RAM Bytes: 1024

Sufficient RAM capacity for data storage and processing, enabling multitasking and efficient program execution.

Maximum Clock Frequency: 5 MHz

High clock frequency supports fast processing speed and real-time applications, improving overall system performance.

Technical Specifications

Microcontrollers ST90135M6Q6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7 TO 5.5V SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G80

JESD-609 Code:

e4

Length:

20 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90135M6Q6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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