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ST90135M5Q6

STMicroelectronics

ST90135M5Q6 by STMicroelectronics

ST90135M5Q6 by STMicroelectronics is a 16-bit microcontroller with 80 terminals, operating at up to 5.5V. It features 768 bytes of RAM, ADC and DMA channels, and a max clock frequency of 5MHz. Ideal for industrial applications requiring high-speed data processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,415 parts In-Stock

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3,415

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Digiode

USA . 3,393 parts In-Stock

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3,393

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Anansix

USA . 1,753 parts In-Stock

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1,753

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,318 parts In-Stock

1+ parts

$29.983

100+ parts

-

1k+ parts

$26.985

10k+ parts

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2,318

$29.983

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$26.985

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MKK Technologies

India . 1,779 parts In-Stock

1+ parts

$56.381

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1,779

$56.381

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DigiPath Technology Company

USA . 1,779 parts In-Stock

1+ parts

$56.381

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10k+ parts

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1,779

$56.381

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Corphita

USA . 2,442 parts In-Stock

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2,442

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Parana Technologies

USA . 1,942 parts In-Stock

1+ parts

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100+ parts

$35.849

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1,942

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$35.849

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Overview

Elevate your projects with the ST90135M5Q6 microcontroller by STMicroelectronics, a leader in cutting-edge technology. Perfect for a wide range of applications, this versatile device offers unparalleled quality and performance. With its advanced features and reliable manufacturing, this microcontroller provides value and benefits that customers can trust. Experience seamless integration and exceptional functionality with the ST90135M5Q6, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: Yes

Being surface mountable makes the product easy to integrate onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 16

With a 16-bit address bus width, the microcontroller can access a larger memory space, enabling more complex applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a PCB and easy integration into various designs.

Bit Size: 16

With a 16-bit architecture, the microcontroller can process data in larger chunks, improving overall performance.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies provides flexibility in system design and power management.

No. of Terminals: 80

Having 80 terminals allows for a variety of connectivity options and interfaces, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor and ease of mounting, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even under varying voltage conditions, enhancing system stability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions, ideal for industrial applications.

CPU Family: ST9

Belonging to the ST9 CPU family ensures compatibility with existing software and tools, simplifying development and support.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function in extreme cold environments, expanding its use cases.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections over time.

ADC Channels: Yes

Having ADC channels onboard allows the microcontroller to convert analog signals to digital, enabling sensor interfacing and data acquisition capabilities.

DMA Channels: Yes

DMA channels reduce the load on the CPU by enabling direct data transfers between peripherals and memory, improving overall system efficiency.

Terminal Position: QUAD

The quad terminal position facilitates easy PCB layout and routing, enhancing the overall design flexibility.

ROM Words: 24576

With a large ROM capacity, the microcontroller can store extensive program code and data, supporting complex applications.

Maximum Seated Height: 3.4 mm

The low seated height allows for a slim profile, making the microcontroller suitable for compact electronic devices.

Width: 14 mm

The narrow width enables the microcontroller to fit into tight spaces, ideal for applications with limited board space.

External Data Bus Width: 8

An 8-bit external data bus width simplifies interfacing with peripherals and memory components, enhancing system compatibility.

Maximum Clock Frequency: 5 MHz

With a maximum clock frequency of 5 MHz, the microcontroller can deliver high-speed processing capabilities, accelerating system performance.

Length: 20 mm

The compact length makes the microcontroller suitable for applications where space is a premium, ensuring efficient use of available board area.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operation, the microcontroller can withstand challenging environmental conditions and maintain reliable performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

RAM Bytes: 768

With 768 bytes of RAM, the microcontroller can efficiently store and manipulate data during runtime, supporting multitasking and data processing tasks.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and robust performance in diverse applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder connections and ease of PCB assembly, enhancing the overall reliability of the microcontroller.

Maximum Supply Current: 40 mA

The low maximum supply current requirement reduces power consumption, making the microcontroller energy-efficient and suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility with existing power sources and components.

PWM Channels: Yes

Having PWM channels onboard enables precise control of analog signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: MROM

MROM (Mask ROM) provides permanent and secure storage of firmware code, ensuring data integrity and preventing unauthorized modifications.

Terminal Pitch: 0.8 mm

The narrow terminal pitch facilitates high-density PCB layouts, enabling more functionality to be packed into a small space.

Speed: 24 rpm

With a speed rating of 24 RPM, the microcontroller can process instructions and data quickly, enhancing overall system responsiveness.

No. of I/O Lines: 67

Having 67 I/O lines offers ample connectivity options for interfacing with various peripherals and external devices, making the microcontroller versatile in different applications.

Technical Specifications

Microcontrollers ST90135M5Q6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7 TO 5.5V SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G80

JESD-609 Code:

e4

Length:

20 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

24576

ROM Programmability:

MROM

Maximum Seated Height:

3.4 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90135M5Q6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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