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ST9020B6

STMicroelectronics

ST9020B6 by STMicroelectronics

ST9020B6 by STMicroelectronics is a 16-bit microcontroller with 5V supply, 24MHz clock speed, and 224 RAM words. Ideal for industrial applications due to -40 to 85 °C operating temp range, it features 9 external interrupts and DMA channels for efficient data transfer. With a compact IN-LINE package style and low power mode, it offers versatile performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,474 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,474

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Digiode

USA . 2,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,765

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Anansix

USA . 1,007 parts In-Stock

1+ parts

-

100+ parts

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1,007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 103 parts In-Stock

1+ parts

$54.470

100+ parts

-

1k+ parts

$49.023

10k+ parts

-

103

$54.470

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$49.023

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MKK Technologies

India . 1,082 parts In-Stock

1+ parts

$102.426

100+ parts

-

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-

10k+ parts

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1,082

$102.426

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DigiPath Technology Company

USA . 1,082 parts In-Stock

1+ parts

$102.426

100+ parts

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10k+ parts

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1,082

$102.426

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Corphita

USA . 2,962 parts In-Stock

1+ parts

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2,962

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Parana Technologies

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

$65.127

1k+ parts

-

10k+ parts

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2,063

-

$65.127

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Overview

Get ready to experience the next level of performance with the ST9020B6 microcontroller by STMicroelectronics. This high-quality product offers unmatched reliability and efficiency, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers outstanding value, benefits, and advantages to customers looking for cutting-edge technology. Trust STMicroelectronics to provide you with the best in microcontroller innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of peripherals.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient data processing and storage, enhancing the performance of the microcontroller.

Address Bus Width: 12

The 12-bit address bus width enables the microcontroller to access a larger memory space, making it suitable for applications requiring extensive data storage.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards and compact designs.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle larger data sets and perform more complex operations, making it suitable for advanced applications.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage levels used in many electronic systems.

No. of Terminals: 40

The large number of terminals provides abundant connectivity options for interfacing with external components and peripherals.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout and assembly, making it easier for designers to implement the microcontroller in their projects.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even with fluctuating power sources, increasing the robustness of the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and extreme temperature fluctuations.

CPU Family: ST9

The ST9 CPU family offers optimized performance and features for embedded applications, making it a reliable choice for diverse projects.

No. of External Interrupts: 9

The 9 external interrupts allow for efficient handling of external events and real-time response, enhancing the microcontroller's versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the microcontroller to function reliably in cold environments or during temperature fluctuations.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and electrical conductivity, ensuring secure connections in the circuit.

DMA Channels: YES

The presence of DMA channels enables direct memory access for efficient data transfer and processing, reducing the workload on the CPU.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options and allows for versatile PCB layouts, enhancing usability in various designs.

ROM Words: 12288

The large ROM capacity allows for storing a significant amount of program code and data, making the microcontroller suitable for complex applications.

RAM Words: 224

The ample RAM capacity enables efficient data storage and manipulation, facilitating smooth operation of the microcontroller in various tasks.

External Data Bus Width: 8

The 8-bit external data bus width allows for quick data transfer between the microcontroller and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency provides fast processing speed and responsiveness, making the microcontroller suitable for applications requiring real-time operation.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments with temperature extremes, making it suitable for industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product integrates various peripherals and interfaces into a single chip, simplifying system design and reducing component count.

No. of Timers: 2

The two timers provide essential timing and counting capabilities for various applications, enhancing the versatility and functionality of the microcontroller.

RAM Bytes: 224

With 224 bytes of RAM, the microcontroller can efficiently store and manipulate data during program execution, ensuring smooth and efficient operation.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable in operation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides reliable mechanical support and secure connections, making it suitable for applications that require robust mounting and soldering.

Maximum Supply Current: 40 mA

The low maximum supply current helps in minimizing power consumption and heat dissipation, increasing the efficiency and reliability of the microcontroller.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in electronics, ensuring compatibility with existing systems and power sources.

No. of DMA Channels: 4

The four DMA channels provide efficient data transfer and processing capabilities, reducing CPU overhead and improving system performance.

No. of Serial I/Os: 2

The two serial I/O interfaces enable communication with external devices and peripherals using serial protocols, enhancing connectivity and functionality.

ROM Programmability: MROM

MROM (Mask ROM) programmability ensures secure and non-volatile storage of firmware and data, preventing unauthorized access or modification.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch allows for easy integration into standard PCB designs and socket connectors, ensuring compatibility and ease of assembly.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and mathematical calculations, making it suitable for applications that do not require floating-point precision.

Speed: 24 rpm

The 24 rpm speed rating indicates the maximum clock frequency of the microcontroller, defining its processing speed and performance capabilities.

Low Power Mode: YES

The low power mode feature allows the microcontroller to operate in a power-efficient state, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

The 8-bit program ROM width enables efficient storage of program code and instructions, contributing to the microcontroller's overall performance and functionality.

No. of I/O Lines: 34

With 34 I/O lines, the microcontroller offers abundant input and output options for interfacing with external sensors, peripherals, and devices, enhancing its versatility and connectivity.

Technical Specifications

Microcontrollers ST9020B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Additional Features:

CAPTURE/COMPARE UNIT

Address Bus Width:

12

Bit Size:

16

Boundary Scan:

NO

CPU Family:

ST9

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e0

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

9

No. of I/O Lines:

34

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

224

RAM Words:

224

ROM Words:

12288

ROM Programmability:

MROM

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

ST9020B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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