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ST90158M7T6

STMicroelectronics

ST90158M7T6 by STMicroelectronics

ST90158M7T6 by STMicroelectronics is a 16-bit microcontroller with 16-bit address bus width, operating at up to 5 MHz. It features 1536 bytes of RAM, ADC and DMA channels, suitable for industrial applications requiring low profile design and high clock frequency.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 2,438 parts In-Stock

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Vyrian

USA . 2,355 parts In-Stock

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2,355

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Anansix

USA . 2,142 parts In-Stock

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2,142

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IDEA Electronic Components Group

UK . 1,231 parts In-Stock

1+ parts

$27.757

100+ parts

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1k+ parts

$24.982

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1,231

$27.757

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$24.982

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MKK Technologies

India . 555 parts In-Stock

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$52.196

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555

$52.196

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DigiPath Technology Company

USA . 555 parts In-Stock

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$52.196

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555

$52.196

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Parana Technologies

USA . 1,897 parts In-Stock

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$33.188

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1,897

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$33.188

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Corphita

USA . 765 parts In-Stock

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765

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Overview

Unlock the power of innovation with the ST90158M7T6 microcontroller from STMicroelectronics. Designed with precision and reliability, this versatile device offers endless possibilities for applications in a wide range of industries. With advanced features like ADC and DMA channels, along with a robust ROM size of 49152 words, this microcontroller provides maximum performance and efficiency. Trust in STMicroelectronics' reputation for excellence and choose the ST90158M7T6 for all your microcontroller needs. Elevate your projects to new heights with the cutting-edge technology and superior quality of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient placement on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 16

A wider address bus allows for accessing larger memory spaces and handling complex data operations.

Package Shape: SQUARE

Square packages are easy to work with and provide efficient use of space on a circuit board.

Bit Size: 16

With a larger bit size, the microcontroller can handle more data at once, increasing processing power.

Power Supplies (V): 3/5

Having multiple power supply options allows for flexibility in voltage requirements, making the product adaptable to different environments.

No. of Terminals: 80

With a high number of terminals, the microcontroller can interface with a variety of external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile package style saves space and allows for compact designs in electronic systems.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage ensures that the microcontroller can operate efficiently even with low power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial applications where heat may be a factor.

CPU Family: ST9

Being part of the ST9 CPU family ensures compatibility and support for a range of software and development tools.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in harsh environments with extreme cold.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positions provide stability and ease of soldering, ensuring secure connections during assembly.

ROM Words: 49152

With a large ROM memory size, the microcontroller can store extensive program code and data, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact designs and efficient use of space in electronic devices.

Width: 14 mm

The compact width of the microcontroller makes it suitable for use in space-constrained applications.

External Data Bus Width: 8

An external data bus width of 8 allows for efficient data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 5 MHz

A high maximum clock frequency enables fast data processing and execution of instructions, enhancing system speed.

Length: 14 mm

The compact length of the microcontroller makes it suitable for use in small electronic devices and applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the microcontroller can operate reliably in challenging environments.

Peripheral IC Type: MICROCONTROLLER

This microcontroller is designed specifically for controlling and interfacing with external devices and peripherals, making it a versatile choice.

RAM Bytes: 1536

With a large RAM memory size, the microcontroller can handle multiple tasks and store temporary data effectively.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder connections and ease of assembly, ensuring reliable performance in electronic systems.

Maximum Supply Current: 45 mA

With a low maximum supply current, the microcontroller consumes minimal power, making it suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

Having a stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

PWM channels enable precise control of analog signals, facilitating tasks such as motor speed control and LED brightness modulation.

ROM Programmability: MROM

MROM allows for non-volatile storage of program code, ensuring that data is retained even when power is removed.

Terminal Pitch: 0.65 mm

A fine terminal pitch provides a high-density layout, allowing for more terminals in a compact space and promoting efficient board design.

Speed: 24 rpm

With a speed of 24 rpm, the microcontroller can process data and execute instructions quickly, improving overall system performance.

No. of I/O Lines: 67

Having a high number of I/O lines allows for extensive interfacing with external devices, sensors, and components, enhancing system flexibility.

Technical Specifications

Microcontrollers ST90158M7T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

49152

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90158M7T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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