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ST90135M6T6

STMicroelectronics

ST90135M6T6 by STMicroelectronics

ST90135M6T6 by STMicroelectronics is a 16-bit microcontroller with 80 terminals, operating at up to 5 MHz. It features 1024 bytes of RAM, ADC and DMA channels, suitable for industrial applications requiring a wide temperature range (-40 to 85 °C) and low profile design (1.6 mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,933 parts In-Stock

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4,933

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Vyrian

USA . 2,955 parts In-Stock

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2,955

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Anansix

USA . 712 parts In-Stock

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712

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IDEA Electronic Components Group

UK . 2,154 parts In-Stock

1+ parts

$28.822

100+ parts

-

1k+ parts

$25.940

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2,154

$28.822

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$25.940

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MKK Technologies

India . 1,705 parts In-Stock

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$54.197

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1,705

$54.197

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DigiPath Technology Company

USA . 1,705 parts In-Stock

1+ parts

$54.197

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1,705

$54.197

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Corphita

USA . 2,726 parts In-Stock

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2,726

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Parana Technologies

USA . 1,083 parts In-Stock

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$34.461

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1,083

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$34.461

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Overview

Unlock the power of innovation with the ST90135M6T6 microcontroller by STMicroelectronics. Designed with precision and quality, this versatile device offers a wide range of applications in industrial settings, automotive systems, and consumer electronics. With its advanced features and reliable performance, customers can trust in the value and benefits that this product delivers. Experience seamless integration, high efficiency, and optimal functionality with the ST90135M6T6, setting new standards for excellence in the world of microcontrollers. Elevate your projects to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 5.5 V

This higher supply voltage allows for flexibility in power input and compatibility with a wider range of systems.

Address Bus Width: 16

A wider address bus allows for greater memory addressing capabilities, enabling the microcontroller to handle more complex tasks.

Package Shape: SQUARE

The square package shape saves space on the PCB and allows for efficient layout designs.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities and supports more complex algorithms and calculations.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for compatibility with different power sources, enhancing flexibility in application design.

No. of Terminals: 80

Having a higher number of terminals provides more connectivity options and interfaces for peripherals, expanding the microcontroller's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack package style saves space and allows for compact PCB designs, ideal for applications with limited space constraints.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures that the microcontroller can operate efficiently within a wide voltage range, increasing reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and industrial applications.

CPU Family: ST9

Being part of the ST9 CPU family ensures compatibility with existing ST9-based systems and tools, simplifying development and integration processes.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function reliably in cold environments or extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and ensures reliable connections for long-term performance.

ADC Channels: YES

The presence of analog-to-digital converter channels allows the microcontroller to interface with analog sensors and signals, expanding its applicability.

DMA Channels: YES

Support for direct memory access channels enhances data transfer efficiency and offloads the CPU, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers a balanced layout for easy soldering and reliable connections, simplifying manufacturing processes.

ROM Words: 32768

The large ROM capacity of 32768 words enables storing program code and data, accommodating complex applications and algorithms.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact PCB designs and reduces the overall profile of the final product, suitable for space-constrained applications.

Width: 14 mm

Compact width dimensions help in designing compact and efficient PCB layouts, saving space and simplifying integration into electronic systems.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data transfer and processing, suitable for handling a variety of external peripherals and devices.

Maximum Clock Frequency: 5 MHz

The maximum clock frequency of 5 MHz provides fast processing speeds, enabling rapid execution of instructions and tasks.

Length: 14 mm

The compact length dimension contributes to space-saving PCB designs and facilitates integration into small form factor electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Built as a microcontroller, this product integrates various peripherals and features on-chip, reducing external components and simplifying system design.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and access data during program execution, supporting multitasking and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing the microcontroller's efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides a robust mechanical connection and facilitates automated PCB assembly, ensuring reliable and efficient manufacturing processes.

Maximum Supply Current: 45 mA

The moderate maximum supply current of 45 mA indicates low power consumption, leading to energy-efficient operation and prolonged battery life.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing hardware.

PWM Channels: YES

Support for pulse-width modulation channels allows precise control of analog signals and efficient motor or power management applications.

ROM Programmability: MROM

MROM (Mask ROM) programmability provides a secure and reliable permanent storage solution for critical firmware and software, safeguarding against unauthorized modifications.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm enables high-density mounting on the PCB, increasing the number of components that can be placed within a limited space.

Speed: 24 rpm

With a speed rating of 24 revolutions per minute, the microcontroller can efficiently process instructions and tasks in real-time, meeting demanding application requirements.

No. of I/O Lines: 67

Having 67 I/O lines provides ample interfacing options for various sensors, actuators, and external devices, enabling diverse connectivity and functionality.

Technical Specifications

Microcontrollers ST90135M6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90135M6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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