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ST90158M9T6

STMicroelectronics

ST90158M9T6 by STMicroelectronics

ST90158M9T6 by STMicroelectronics is a 16-bit microcontroller with 16-bit address bus width, 2048 bytes RAM, and 65536 ROM words. It operates b/w -40 to 85 °C with a max clock frequency of 5 MHz. Ideal for industrial applications requiring a low-profile package style and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,685 parts In-Stock

1+ parts

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6,685

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Digiode

USA . 1,855 parts In-Stock

1+ parts

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1k+ parts

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1,855

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Anansix

USA . 938 parts In-Stock

1+ parts

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938

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 271 parts In-Stock

1+ parts

$77.622

100+ parts

-

1k+ parts

$69.860

10k+ parts

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271

$77.622

-

$69.860

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MKK Technologies

India . 1,801 parts In-Stock

1+ parts

$145.964

100+ parts

-

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-

10k+ parts

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1,801

$145.964

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DigiPath Technology Company

USA . 1,801 parts In-Stock

1+ parts

$145.964

100+ parts

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10k+ parts

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1,801

$145.964

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Corphita

USA . 1,397 parts In-Stock

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1,397

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Parana Technologies

USA . 339 parts In-Stock

1+ parts

-

100+ parts

$92.809

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-

10k+ parts

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339

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$92.809

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Overview

Experience unparalleled performance and reliability with the ST90158M9T6 microcontroller from industry leader, STMicroelectronics. Ideal for a wide range of applications, this cutting-edge device offers customers unmatched value and benefits. With advanced features like ADC channels, DMA channels, and PWM channels, this product provides seamless integration and high-speed processing capabilities. Trust in the quality and innovation of STMicroelectronics to elevate your projects to new heights with the ST90158M9T6 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures that the microcontroller is easy to handle and resistant to damage during handling and use.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and making the product suitable for densely populated electronics.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages, providing flexibility in power supply options.

Address Bus Width: 16

A wider address bus allows for more memory addressing capability, enabling complex computation tasks and data processing.

Bit Size: 16

With a 16-bit architecture, this microcontroller can process larger chunks of data in a single operation, improving efficiency and performance.

RAM Bytes: 2048

A generous amount of RAM allows for efficient data storage and manipulation, enabling the microcontroller to handle more complex tasks and programs.

Maximum Clock Frequency: 5 MHz

The high maximum clock frequency ensures fast and responsive operation, making the microcontroller suitable for real-time applications and high-speed processing.

No. of I/O Lines: 67

With a large number of I/O lines, this microcontroller can interface with a wide variety of sensors, actuators, and other external devices, making it versatile for different applications.

Technical Specifications

Microcontrollers ST90158M9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90158M9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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