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ST90135M4T6

STMicroelectronics

ST90135M4T6 by STMicroelectronics

ST90135M4T6 by STMicroelectronics is a 16-bit microcontroller with 512 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring ADC and PWM channels. With a temperature range from -40 to 85 °C, it features low profile flatpack packaging and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,354 parts In-Stock

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1,354

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Digiode

USA . 697 parts In-Stock

1+ parts

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697

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Anansix

USA . 680 parts In-Stock

1+ parts

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680

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,093 parts In-Stock

1+ parts

$32.951

100+ parts

-

1k+ parts

$29.656

10k+ parts

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2,093

$32.951

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$29.656

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MKK Technologies

India . 1,961 parts In-Stock

1+ parts

$61.962

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1,961

$61.962

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DigiPath Technology Company

USA . 1,961 parts In-Stock

1+ parts

$61.962

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1,961

$61.962

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Parana Technologies

USA . 1,068 parts In-Stock

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$39.398

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1,068

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$39.398

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Corphita

USA . 491 parts In-Stock

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491

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Overview

Unleash the power of innovation with the ST90135M4T6 microcontroller by STMicroelectronics. Designed with precision and expertise, this cutting-edge device offers unparalleled performance and reliability. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller provides advanced features such as ADC and DMA channels, PWM capabilities, and a 16-bit CPU family. Elevate your projects with the ST90135M4T6, where quality meets value, delivering unmatched benefits and advantages to customers seeking top-tier performance in a compact and efficient package. Trust STMicroelectronics to bring your vision to life with the ST90135M4T6 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy assembly and space-saving design.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for robust performance and versatility in power requirements.

Address Bus Width: 16

Larger address bus width allows for a greater range of memory addressing capability.

Package Shape: SQUARE

Square package shape facilitates easier and more efficient PCB layout.

Bit Size: 16

16-bit architecture provides enhanced processing power and data handling capabilities.

No. of Terminals: 80

Higher number of terminals offer more connectivity options and peripheral interfaces.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures efficient power consumption and operation at lower power levels.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for stable performance in various environmental conditions.

CPU Family: ST9

ST9 CPU family is known for its reliability, performance, and industry-standard compatibility.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and data acquisition capabilities.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU workload.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program data and instructions.

Width: 14 mm

Compact width dimensions make the product suitable for space-constrained applications.

External Data Bus Width: 8

8-bit external data bus width enables efficient data transfer and processing capabilities.

Maximum Clock Frequency: 24 MHz

High clock frequency offers fast processing speed and real-time performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller-based design provides integrated peripheral functionalities for versatile applications.

RAM Bytes: 512

Adequate RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Maximum Supply Current: 45 mA

Low supply current requirement ensures energy efficiency and minimal power consumption.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies power supply design and compatibility.

PWM Channels: YES

PWM channels allow for precise control of output signals and modulation of power levels.

Technical Specifications

Microcontrollers ST90135M4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7 TO 5.5V SUPPLY

Address Bus Width:

16

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90135M4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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