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ST90158M9T1

STMicroelectronics

ST90158M9T1 by STMicroelectronics

ST90158M9T1 microcontroller from STMicroelectronics features a 16-bit architecture with a max supply voltage of 3.15V and operates at up to 14 MHz. It supports ADC and PWM channels, making it ideal for embedded applications in commercial environments. Its compact flatpack design ensures efficient space utilization in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,058 parts In-Stock

1+ parts

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1,058

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Vyrian

USA . 596 parts In-Stock

1+ parts

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596

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Anansix

USA . 405 parts In-Stock

1+ parts

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,649 parts In-Stock

1+ parts

$46.781

100+ parts

-

1k+ parts

$42.103

10k+ parts

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1,649

$46.781

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$42.103

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MKK Technologies

India . 1,851 parts In-Stock

1+ parts

$87.969

100+ parts

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1,851

$87.969

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DigiPath Technology Company

USA . 1,851 parts In-Stock

1+ parts

$87.969

100+ parts

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1,851

$87.969

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Corphita

USA . 1,138 parts In-Stock

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1,138

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Parana Technologies

USA . 405 parts In-Stock

1+ parts

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100+ parts

$55.934

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10k+ parts

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405

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$55.934

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Overview

Elevate your designs with the ST90158M9T1 microcontroller from STMicroelectronics, a leader in semiconductor innovation. Renowned for its exceptional reliability and performance, this compact powerhouse delivers versatile functionalities perfect for diverse applications—from industrial automation to consumer electronics. With low power consumption and robust processing capabilities, it empowers engineers to create cutting-edge solutions that enhance efficiency and drive success. Unlock your project's potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects against environmental factors.

Surface Mount: YES

Surface mount technology allows for increased packing density and smaller circuit board size.

Maximum Supply Voltage: 3.15 V

The maximum supply voltage ensures compatibility with various low-voltage systems.

Address Bus Width: 16

A 16-bit address bus width allows for a greater address space, enabling more memory and peripheral access.

Package Shape: SQUARE

A square package shape provides uniformity and can be easier to integrate into compact designs.

Bit Size: 16

16-bit architecture allows for handling larger data types and more complex computations.

No. of Terminals: 80

With 80 terminals, this microcontroller can support a variety of peripherals and connections.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design makes it suitable for applications where space is at a premium.

Minimum Supply Voltage: 2.85 V

A lower minimum supply voltage ensures operation in battery-powered devices for longer usage.

Maximum Operating Temperature: 70 °C

This temperature range indicates reliability in commercial environments and automotive applications.

Minimum Operating Temperature: 0 °C

Operate in various environmental conditions, making it versatile for different applications.

ADC Channels: YES

Integrated ADC channels allow for real-time data acquisition from analog sensors.

Terminal Position: QUAD

Quad terminal positioning enables easier and more reliable PCB assembly.

Maximum Seated Height: 1.6 mm

A low seated height is ideal for designs requiring compact components with minimal height.

Width: 14 mm

Compact width fits well into small form factor designs and tight spaces.

External Data Bus Width: 8

The 8-bit external data bus allows for efficient communication with other devices and peripherals.

Maximum Clock Frequency: 14 MHz

A maximum clock frequency of 14 MHz supports efficient processing for many embedded applications.

Length: 14 mm

Its compact length facilitates integration into space-constrained designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures adequate performance for general consumer applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it can manage both computation and peripheral control in embedded systems.

Technology: CMOS

CMOS technology provides low power consumption, making it excellent for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate automated soldering processes, enhancing assembly efficiency.

Nominal Supply Voltage: 3 V

The nominal supply voltage is ideal for low-power applications, maximizing battery life.

PWM Channels: YES

PWM channels enable precise control for applications requiring motor speeds or analog signal simulation.

ROM Programmability: MROM

MROM programmability offers flexibility for software updates and customization in embedded systems.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is standard for modern PCB designs, ensuring compatibility with various circuit boards.

Speed: 14 rpm

This speed metric indicates the responsiveness of the microcontroller in real-time processing applications.

No. of I/O Lines: 67

67 I/O lines provide ample connectivity options for various sensors and actuators in embedded projects.

Technical Specifications

Microcontrollers ST90158M9T1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

14 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

14 rpm

Maximum Supply Voltage:

3.15 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST90158M9T1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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