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ST72F651AR6T1E

STMicroelectronics

ST72F651AR6T1E by STMicroelectronics

ST72F651AR6T1E microcontroller from STMicroelectronics features a 12 MHz clock, operates at 3-5.5 V, and includes 64 terminals with ADC and PWM capabilities. Its compact design is ideal for embedded applications requiring efficient processing. With a max temp of 70 °C, it's suitable for commercial use.

Median Price

$7.509

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Arrow

USA . 59 parts In-Stock

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$7.509

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Verical

USA . 59 parts In-Stock

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Chip1Stop

Japan . 59 parts In-Stock

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$8.190

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Digiode

USA . 4,311 parts In-Stock

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$7.134

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Vyrian

USA . 7,861 parts In-Stock

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Anansix

USA . 2,505 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,679 parts In-Stock

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$6.758

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2,679

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AZTECH Wire

Italy . 442 parts In-Stock

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$9.190

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Microchip USA

USA . 248 parts In-Stock

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$19.305

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IDEA Electronic Components Group

UK . 767 parts In-Stock

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$61.068

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$54.961

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767

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MKK Technologies

India . 988 parts In-Stock

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$114.834

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DigiPath Technology Company

USA . 988 parts In-Stock

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$114.834

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QUARKTWIN TECHNOLOGY LTD

USA . 8,400 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,030 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 2,374 parts In-Stock

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$73.016

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Vigor

Singapore . 1,571 parts In-Stock

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Metaverse IC Inc.

Canada . 476 parts In-Stock

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Kepictronics

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Overview

Elevate your projects with the ST72F651AR6T1E microcontroller from STMicroelectronics, a leader in quality and innovation. This versatile 8-bit powerhouse delivers exceptional performance for a wide array of applications, from consumer electronics to industrial automation. With its robust design and advanced features, enjoy seamless integration and reliability that enhances your product's value, ensuring you stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection and reliability for the microcontroller's operation in various environments.

Surface Mount: YES

Being a surface mount device allows for compact designs and easier manufacturing processes, making it suitable for modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum voltage of 5.5 V ensures compatibility with a wide range of power supplies, making it flexible for various applications.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, facilitating easier integration into designs.

Bit Size: 8

An 8-bit architecture is sufficient for many basic control applications, offering a good balance between performance and power consumption.

Power Supplies (V): 3.3/5

Supports both 3.3 V and 5 V power supplies, providing versatility for various applications and ensuring ease of integration.

No. of Terminals: 64

With 64 terminals, this microcontroller can accommodate multiple connections for peripherals and I/O, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is ideal for space-constrained applications while maintaining excellent performance characteristics.

Minimum Supply Voltage: 3 V

A minimum voltage of 3 V allows this microcontroller to operate in low-power applications, making it energy efficient.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C makes it suitable for consumer and commercial applications without risking damage from overheating.

CPU Family: ST72

Part of the ST72 family, ensuring reliable performance and support, along with a robust ecosystem of development tools and resources.

Minimum Operating Temperature: 0 °C

An operating range down to 0 °C makes this microcontroller versatile for outdoor and varied climatic applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent solderability and long-term reliability against corrosion.

ADC Channels: YES

ADC capabilities allow for analog signal processing, enabling a wide range of sensor applications and making it suitable for embedded systems.

Terminal Position: QUAD

Quad terminal position improves connections on the PCB, allowing for better signal integrity and thermal performance.

ROM Words: 32768

With 32,768 ROM words, there is ample storage for application code, making it suitable for various embedded applications.

Maximum Seated Height: 1.6 mm

The low seated height facilitates a compact design, which is beneficial for space-sensitive applications in modern electronics.

Width: 10 mm

A width of 10 mm helps to maintain a small footprint on the PCB, essential for miniaturization in modern electronics.

Maximum Clock Frequency: 12 MHz

A maximum clock frequency of 12 MHz ensures adequate processing speed for many control applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds helps prevent damage during assembly, ensuring reliable performance after manufacturing.

Peak Reflow Temperature °C: 260

Able to withstand high reflow temperatures gives this microcontroller flexibility in manufacturing processes.

Length: 10 mm

The 10 mm length complements the width, maintaining a compact design suitable for space-constrained electronic applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the microcontroller operates reliably in typical indoor and outdoor environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and input/output control in one chip, streamlining design and reducing board space.

RAM Bytes: 5120

With 5,120 bytes of RAM, this microcontroller supports more complex programs and data handling for various applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher integration density, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and excellent mechanical stability on the PCB.

Maximum Supply Current: 8 mA

A supply current of only 8 mA ensures power efficiency, making this microcontroller well-suited for low-power applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with many standard power supplies, ensuring compatibility with existing hardware.

PWM Channels: YES

PWM channels enable effective motor control and signal generation, expanding the microcontroller's application range.

ROM Programmability: FLASH

With flash programmability, it offers easy updates and reprogramming capabilities for evolving application needs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm caters to modern design needs, allowing for high-density packing of components on PCBs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, which is manageable in most assembly processes.

Speed: 3 rpm

The speed capability of 3 rpm allows for precise control in applications like motor drives and robotics.

No. of I/O Lines: 47

With 47 I/O lines available, this microcontroller can connect to multiple sensors and devices, enhancing its application flexibility.

Technical Specifications

Microcontrollers ST72F651AR6T1E attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 3 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

5120

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F651AR6T1E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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