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ST72F63BK6M1

STMicroelectronics

ST72F63BK6M1 by STMicroelectronics

ST72F63BK6M1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 24 MHz, operating voltage b/w 4-5.5 V, and 34 terminals. It supports ADC and PWM channels, making it ideal for embedded applications. Its compact design ensures efficient performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,908 parts In-Stock

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Anansix

USA . 1,573 parts In-Stock

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1,573

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Digiode

USA . 88 parts In-Stock

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88

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Distributors (Availability)

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AZTECH Wire

Italy . 640 parts In-Stock

1+ parts

$11.310

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640

$11.310

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Microchip USA

USA . 314 parts In-Stock

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$15.523

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314

$15.523

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IDEA Electronic Components Group

UK . 2,326 parts In-Stock

1+ parts

$16.601

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$14.941

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2,326

$16.601

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$14.941

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MKK Technologies

India . 1,164 parts In-Stock

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$31.218

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1,164

$31.218

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DigiPath Technology Company

USA . 1,164 parts In-Stock

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$31.218

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$31.218

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Corphita

USA . 4,616 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,538 parts In-Stock

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4,538

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Parana Technologies

USA . 1,966 parts In-Stock

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$19.850

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1,966

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$19.850

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Vigor

Singapore . 1,339 parts In-Stock

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Kepictronics

USA . 82 parts In-Stock

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Overview

Unlock unparalleled performance with the ST72F63BK6M1 microcontroller from STMicroelectronics, renowned for its commitment to quality and innovation. Designed for versatility, this compact powerhouse excels in automotive, industrial, and consumer applications. Experience enhanced efficiency, superior processing capabilities, and seamless integration into your projects. Elevate your designs with a trusted partner that delivers reliability and cutting-edge technology, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology offers a compact design, allowing for higher circuit density and smaller PCB sizes, which is advantageous for space-constrained projects.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the microcontroller is compatible with common voltage levels found in many electronic systems.

Package Shape: RECTANGULAR

The rectangular package shape can help in efficient layout on PCBs and provides ease in mounting for automated assembly.

Bit Size: 8

An 8-bit architecture allows for simplicity in design and programming, making it accessible for beginners and small-scale applications.

Power Supplies (V): 5

Operating with a standard 5V supply makes integration into standard electronic circuits straightforward and efficient.

No. of Terminals: 34

Having 34 terminals provides flexibility in I/O options, enabling complex functionality and expansion capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for compact systems, making the microcontroller suitable for portable and space-constrained applications.

Minimum Supply Voltage: 4 V

A minimum supply voltage of 4 V ensures stable operation in a variety of voltage conditions, allowing for broader usability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller is suitable for a range of environments, including commercial applications.

CPU Family: ST72

The ST72 CPU family provides reliable processing capabilities, often used in many industry applications.

Minimum Operating Temperature: 0 °C

Operating effectively from 0 °C allows the microcontroller to function in a variety of applications, including industrial settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish enhances solderability and durability, making the microcontroller reliable for long-term use.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog sensors, expanding its application scope notably.

DMA Channels: YES

DMA channels facilitate efficient data transfer, improving performance by offloading tasks from the CPU and enabling multitasking.

Terminal Position: DUAL

The dual terminal positioning allows for easier connection and integration into circuit designs, improving usability.

ROM Words: 32768

With 32K ROM words, there's ample space for code storage, supporting complex applications and functionalities.

Maximum Seated Height: 2.642 mm

The low seated height makes it compatible with low-profile designs, enhancing its applicability in compact electronic devices.

Width: 7.5 mm

A width of 7.5 mm allows for easy integration into tightly spaced designs, making it flexible for various layouts.

Maximum Clock Frequency: 24 MHz

A clock frequency of 24 MHz delivers adequate processing power for many real-time applications, striking a balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Supporting a maximum time at peak reflow temperature of 30 seconds ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures robustness during manufacturing, ensuring that the components can withstand typical assembly processes.

Length: 17.894 mm

The length provides a compact form factor, enabling use in size-constrained projects without sacrificing functionality.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliability for consumer applications, making it suitable for a wide range of standard electronic devices.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows this device to serve a multifunctional role, making it ideal for controlling various electronic systems.

RAM Bytes: 1024

With 1024 bytes of RAM, there is sufficient memory for temporary data storage, supporting more complex applications.

Technology: CMOS

Based on CMOS technology, this microcontroller offers low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and mechanical stability, enhancing the reliability of the connections.

Maximum Supply Current: 13 mA

A maximum supply current of 13 mA allows for low-power operation in battery-powered and energy-sensitive applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V aligns well with many standard systems, simplifying integration.

PWM Channels: YES

The presence of PWM channels facilitates advanced control of motors and other devices, making it ideal for robotics and control systems.

ROM Programmability: FLASH

With FLASH ROM programmability, users can easily update and modify the program without needing to replace the chip.

Terminal Pitch: 1.016 mm

A terminal pitch of 1.016 mm allows for compact placement on PCBs, fitting well into high-density designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 efficiency suggests a moderate level of moisture resistance, providing adequate protection during handling and assembly.

Speed: 8 rpm

A speed of 8 rpm indicates suitable control capabilities for various low-speed applications, particularly in automation and robotics.

No. of I/O Lines: 19

Having 19 I/O lines allows for a good number of inputs and outputs, making the microcontroller versatile for different interfacing needs.

Technical Specifications

Microcontrollers ST72F63BK6M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G34

JESD-609 Code:

e4

Length:

17.894 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

19

No. of Terminals:

34

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP34,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

2.642 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.016 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72F63BK6M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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