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ST72F561K6TA

STMicroelectronics

ST72F561K6TA by STMicroelectronics

ST72F561K6TA microcontroller from STMicroelectronics features a 5V supply, 32 terminals, and operates at temperatures from -40 °C to 85 °C. With 16 MHz max clock speed and 32KB ROM, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,266 parts In-Stock

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Digiode

USA . 2,995 parts In-Stock

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2,995

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Anansix

USA . 1,024 parts In-Stock

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1,024

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Distributors (Availability)

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Microchip USA

USA . 339 parts In-Stock

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$4.163

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339

$4.163

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AZTECH Wire

Italy . 560 parts In-Stock

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$10.310

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560

$10.310

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IDEA Electronic Components Group

UK . 281 parts In-Stock

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$45.624

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$41.061

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281

$45.624

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$41.061

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MKK Technologies

India . 189 parts In-Stock

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$85.792

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189

$85.792

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DigiPath Technology Company

USA . 189 parts In-Stock

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$85.792

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189

$85.792

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A-Z Elektronik GmbH

Germany . 4,697 parts In-Stock

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Corphita

USA . 2,583 parts In-Stock

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2,583

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Parana Technologies

USA . 2,032 parts In-Stock

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$54.550

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$54.550

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Vigor

Singapore . 1,317 parts In-Stock

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Overview

Unlock the potential of your projects with the ST72F561K6TA microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact powerhouse delivers exceptional performance and reliability, making it ideal for diverse applications—from industrial automation to consumer electronics. Experience seamless integration and long-lasting efficiency, ensuring your innovations thrive in any environment. Trust STMicroelectronics for superior technology that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures long-lasting performance and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power systems.

Package Shape: SQUARE

The square shape provides easy integration into various electronic designs, optimizing layout efficiency.

Bit Size: 8

The 8-bit architecture makes it suitable for basic control applications with lower computational needs.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it accessible for common projects.

No. of Terminals: 32

With 32 terminals, it offers ample connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile design allows for use in space-constrained applications while maintaining performance.

Minimum Supply Voltage: 4.5 V

Allows for operation in a variety of environments with minor fluctuations in power supply.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it ideal for outdoor and harsh environment applications.

Terminal Finish: Matte Tin (Sn)

Provides good solderability and corrosion resistance, which extends the lifespan of the product.

ADC Channels: YES

Built-in ADC channels allow for easy interfacing with analog sensors, expanding its application uses.

Terminal Position: QUAD

Quad terminal positioning provides stable connections and enhances the integrity of the circuit.

ROM Words: 32768

Offers sufficient ROM capacity for storing programs and data, allowing complex application execution.

Maximum Seated Height: 1.6 mm

Low seated height facilitates incorporation into low-profile devices and compact designs.

Width: 7 mm

Compact width makes it suitable for various applications where space is critical.

Maximum Clock Frequency: 16 MHz

Supports decent processing power for a range of applications, striking a balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures reliability and stability during the soldering process in manufacturing.

Peak Reflow Temperature: 235 °C

Capable of handling the high temperatures found in modern PCB assembly processes.

Length: 7 mm

Its short length adds to the compact design, which is suitable for portable applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Serves as a versatile control unit suitable for a variety of embedded applications.

RAM Bytes: 1024

Adequate RAM size allows for efficient handling of data during operation.

Technology: CMOS

CMOS technology provides low power consumption, enhancing battery life in portable applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easier soldering and reliable connections on PCBs.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA allows this microcontroller to power various peripheral devices.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with common electronic components.

PWM Channels: YES

The presence of PWM channels makes it suitable for controlling motors and other actuators.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware.

Terminal Pitch: 0.8 mm

Finer terminal pitch enables more compact layouts in electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates appropriate handling and storage requirements, ensuring product reliability.

Speed: 8 rpm

The specified speed makes this microcontroller suitable for low-speed motor control applications.

No. of I/O Lines: 24

24 I/O lines provide flexibility for interfacing with multiple components and sensors.

Technical Specifications

Microcontrollers ST72F561K6TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F561K6TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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