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ST72F561AR9T3

STMicroelectronics

ST72F561AR9T3 by STMicroelectronics

ST72F561AR9T3 microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w -40 °C to 125 °C, and supports 48 I/O lines. With 61440 ROM words and flash programmability, it's ideal for automotive applications. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,313 parts In-Stock

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Digiode

USA . 4,141 parts In-Stock

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Anansix

USA . 870 parts In-Stock

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870

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Microchip USA

USA . 162 parts In-Stock

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$11.553

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162

$11.553

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AZTECH Wire

Italy . 458 parts In-Stock

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$20.280

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458

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IDEA Electronic Components Group

UK . 383 parts In-Stock

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$67.327

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$60.594

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Component Stockers USA

USA . 660 parts In-Stock

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$99.990

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$99.990

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MKK Technologies

India . 2,075 parts In-Stock

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$126.603

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$126.603

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DigiPath Technology Company

USA . 2,075 parts In-Stock

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$126.603

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Vigor

Singapore . 9,451 parts In-Stock

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Parana Technologies

USA . 2,236 parts In-Stock

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$80.499

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Corphita

USA . 1,009 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Elevate your innovations with the ST72F561AR9T3 microcontroller from STMicroelectronics, a global leader in high-quality semiconductor solutions. Designed for reliability and efficiency, this versatile 8-bit MCU supports automotive applications while ensuring optimal performance across varying temperatures. With robust features and exceptional power management, it empowers you to create smarter, more efficient devices, enhancing quality and driving success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling efficient use of space on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a stable voltage range for reliable performance in power-sensitive applications.

Package Shape: SQUARE

The square package shape simplifies layout design and is ideal for high-density designs.

Bit Size: 8

An 8-bit architecture is cost-effective and suitable for simpler applications that don't require complex computing power.

Power Supplies (V): 5

Standard 5V power supply simplifies integration with existing components and systems.

No. of Terminals: 64

A higher number of terminals allows for multiple I/O options, enhancing versatility in applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style is ideal for designs with space constraints, helping to minimize overall device height.

Minimum Supply Voltage: 4.5 V

This range ensures the product operates reliably in various voltage supply conditions.

Maximum Operating Temperature: 125 °C

Excellent temperature tolerance makes it suitable for automotive and industrial applications where high heat is a factor.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, enhancing performance in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish improves solderability and enhances the reliability of the connection.

ADC Channels: YES

The inclusion of ADC channels enables direct interfacing with sensors for data acquisition, increasing functionality.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and better signal integrity.

ROM Words: 61440

A substantial ROM capacity allows for greater program storage, enhancing application complexity.

Maximum Seated Height: 1.6 mm

Low seated height is advantageous for low-profile designs in compact electronic applications.

Width: 10 mm

A manageable width aids in compatibility with a variety of circuit layouts and designs.

Maximum Clock Frequency: 16 MHz

A 16 MHz maximum clock frequency provides adequate processing speed for many microcontroller tasks.

Maximum Time At Peak Reflow Temperature: 30 s

A reasonable reflow time supports compatibility with typical manufacturing processes.

Peak Reflow Temperature: 260 °C

Handles peak temperatures commonly required in surface mount soldering, ensuring quality assembly.

Length: 10 mm

A compact length aids in designs requiring minimal space for component placement.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance under harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller functionality allows for diverse applications, from simple tasks to complex systems.

RAM Bytes: 2048

2 KB of RAM supports moderate data processing needs suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy PCB mounting and soldering.

Maximum Supply Current: 150 mA

With a maximum supply current of 150 mA, the microcontroller can power auxiliary devices, making it versatile.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V keeps it compatible with various standard electronic components.

PWM Channels: YES

PWM channel capabilities enable control of motors and other devices, enhancing control system applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density applications, making it suitable for modern designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates good resistance to moisture, suitable for a variety of manufacturing environments.

Speed: 8 rpm

A specified speed of 8 rpm can be tied to motor control applications, indicating its use in low-speed operations.

No. of I/O Lines: 48

Having 48 I/O lines enhances connectivity, allowing the microcontroller to interface with numerous devices simultaneously.

Technical Specifications

Microcontrollers ST72F561AR9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561AR9T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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