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ST72F361J9T6

STMicroelectronics

ST72F361J9T6 by STMicroelectronics

ST72F361J9T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 18 external interrupts, and 2048 bytes of RAM. It operates within -40 °C to 85 °C and is ideal for industrial applications requiring low power consumption and robust performance. Its compact design supports various connectivity options like LIN and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,006 parts In-Stock

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3,006

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Digiode

USA . 1,967 parts In-Stock

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1,967

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Anansix

USA . 390 parts In-Stock

1+ parts

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390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 364 parts In-Stock

1+ parts

$7.427

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364

$7.427

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AZTECH Wire

Italy . 1,082 parts In-Stock

1+ parts

$14.980

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1,082

$14.980

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IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$71.132

100+ parts

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$64.018

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786

$71.132

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$64.018

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MKK Technologies

India . 2,069 parts In-Stock

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$133.758

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2,069

$133.758

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DigiPath Technology Company

USA . 2,069 parts In-Stock

1+ parts

$133.758

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2,069

$133.758

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Corphita

USA . 4,353 parts In-Stock

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4,353

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Vigor

Singapore . 2,684 parts In-Stock

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2,684

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Parana Technologies

USA . 2,290 parts In-Stock

1+ parts

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$85.049

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2,290

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$85.049

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Overview

Unlock unparalleled performance with the ST72F361J9T6 microcontroller from STMicroelectronics. Renowned for its quality and innovation, STMicroelectronics delivers a reliable solution perfect for industrial applications requiring precision and efficiency. With robust features like low power consumption and extensive connectivity options, this microcontroller empowers your designs to enhance functionality while minimizing costs. Elevate your projects with a trusted partner in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and easy handling.

Surface Mount: YES

Supports modern assembly techniques, allowing for compact designs and improved reliability.

Maximum Supply Voltage: 5.5 V

Safe operating voltage margin allows integration with typical power supply systems.

On Chip Data RAM Width: 8

Optimized for handling 8-bit operations efficiently, enhancing performance in various applications.

Package Shape: SQUARE

Space-efficient design aids in PCB layout optimization.

Bit Size: 8

Suitable for a wide variety of embedded applications requiring low-power operations.

No. of Terminals: 44

Provides ample connectivity options for expanded peripherals and I/O functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

Ideal for applications where height restrictions are critical, promoting design versatility.

Minimum Supply Voltage: 4.5 V

Flexibility in power supply design, enabling operation under various conditions.

Maximum Operating Temperature: 85 °C

Suitable for a range of applications, including industrial environments with moderate heat.

CPU Family: ST7

Proven family known for reliability and performance in embedded systems.

No. of External Interrupts: 18

High number of interrupts allows for responsive interaction with external devices.

Minimum Operating Temperature: -40 °C

Capable of functioning in harsh environments, extending product use cases.

ADC Channels: YES

Integrated analog-to-digital conversion capability streamlines design for sensor applications.

Terminal Position: QUAD

Facilitates efficient and organized layout on PCBs, improving manufacturability.

ROM Words: 61440

Large memory capacity supports complex software applications and data storage.

Maximum Seated Height: 1.6 mm

Low profile helps maintain space efficiency in compact device designs.

RAM Words: 1024

Provides sufficient memory for executing applications, making it suitable for diverse tasks.

Width: 10 mm

Compact size makes it fitting for small electronic devices and embedded systems.

Peripherals: POR; TIMER(4); RTC; WDT

Integrated peripherals reduce the need for additional components, simplifying designs.

Maximum Clock Frequency: 16 MHz

Adequate processing speed for many applications while maintaining power efficiency.

Length: 10 mm

Small form factor suitable for compact PCB layouts and space-constricted applications.

Temperature Grade: INDUSTRIAL

Ensures reliability and performance in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

Versatile application in control systems, sensor processing, and other embedded tasks.

RAM Bytes: 2048

Sufficient random access memory for smooth multitasking and processing of tasks.

Technology: CMOS

Provides high efficiency and low power consumption, ideal for battery-powered applications.

Terminal Form: GULL WING

Gull-wing leads provide excellent soldering characteristics for reliable connections.

Analog To Digital Converters: 16-Ch 10-Bit

High-resolution conversion allows for precise measurements in various applications.

Maximum Supply Current: 15 mA

Low current consumption enhances battery life in portable devices.

Nominal Supply Voltage: 5 V

Common supply voltage simplifies integration with existing systems.

Connectivity: LIN(2); SPI

Multiple connectivity options enable easy integration with different devices and protocols.

ROM Programmability: FLASH

Reprogrammable memory allows for updates and changes in application software post-deployment.

Terminal Pitch: 0.8 mm

Narrow pitch allows for higher density component placement without compromising performance.

Format: FLOATING POINT

Support for floating-point operations enhances computational capability for complex applications.

Speed: 8 rpm

Ideal operational speed for applications requiring precise timing control.

Low Power Mode: YES

Supports energy-saving modes, extending battery life in energy-sensitive applications.

On Chip Program ROM Width: 8

Efficient ROM design for executing 8-bit program code efficiently.

No. of I/O Lines: 34

Abundant I/O lines allow for extensive interfacing possibilities, catering to complex requirements.

Technical Specifications

Microcontrollers ST72F361J9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

18

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361J9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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