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ST72F32AJ2T6

STMicroelectronics

ST72F32AJ2T6 by STMicroelectronics

ST72F32AJ2T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 8-bit architecture, and operates b/w -40 °C to 85 °C. With 8192 ROM words and 384 RAM bytes, it's ideal for industrial applications requiring reliable performance. Its low-profile design supports various connectivity options like SCI and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,745 parts In-Stock

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Digiode

USA . 2,920 parts In-Stock

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2,920

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Anansix

USA . 1,224 parts In-Stock

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1,224

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Distributors (Availability)

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Microchip USA

USA . 453 parts In-Stock

1+ parts

$4.585

100+ parts

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453

$4.585

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AZTECH Wire

Italy . 213 parts In-Stock

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$21.670

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213

$21.670

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IDEA Electronic Components Group

UK . 286 parts In-Stock

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$71.852

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$64.667

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286

$71.852

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$64.667

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MKK Technologies

India . 1,898 parts In-Stock

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$135.113

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1,898

$135.113

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DigiPath Technology Company

USA . 1,898 parts In-Stock

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$135.113

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1,898

$135.113

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QUARKTWIN TECHNOLOGY LTD

USA . 22,342 parts In-Stock

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Assy Fe

Spain . 5,760 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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5,500

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Corphita

USA . 3,697 parts In-Stock

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3,697

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Parana Technologies

USA . 1,770 parts In-Stock

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$85.910

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1,770

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$85.910

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Vigor

Singapore . 1,505 parts In-Stock

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Overview

Unlock exceptional performance with the ST72F32AJ2T6 microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for diverse applications, this highly efficient 8-bit controller excels in industrial settings, offering robust temperature ranges and low power consumption. With integrated ADC and PWM capabilities, it seamlessly enhances your designs. Trust in STMicroelectronics' quality to elevate your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures longevity and reliability in various environments.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

Its ability to operate up to 5.5 V allows flexibility in integration with different power systems.

Package Shape: SQUARE

Square package shape optimizes space usage and can be easily integrated into most layouts.

Bit Size: 8

8-bit architecture provides a balance between performance and resource usage, ideal for many applications.

Power Supplies (V): 5

Standard 5V power supply enhances compatibility with a wide range of components.

No. of Terminals: 44

A higher number of terminals provides more connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design is suited for compact applications, reducing height in enclosures.

Minimum Supply Voltage: 3.8 V

Flexible supply voltage range starting at 3.8 V supports battery-operated applications.

Maximum Operating Temperature: 85 °C

High operating temperature limit allows usage in demanding industrial environments.

CPU Family: ST72

Part of the ST72 family, ensuring a well-established ecosystem and support for development.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 to 85 °C) enables reliable performance in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of corrosion over time.

ADC Channels: YES

Embedded ADC channels allow for efficient analog data processing within the microcontroller.

Terminal Position: QUAD

Quad terminal positioning facilitates easier connections in multi-layer circuit designs.

ROM Words: 8192

8K ROM provides ample space for applications, making it suitable for various control tasks.

Maximum Seated Height: 1.6 mm

Low seated height supports compact PCB designs while ensuring ease of placement.

Width: 10 mm

Compact width allows for dense arrangements in circuit designs without sacrificing functionality.

Peripherals: TIMER(4)

Four integrated timers enhance versatility and functionality for real-time applications.

Maximum Clock Frequency: 16 MHz

16 MHz clock speed ensures efficient execution of tasks and responsiveness in control applications.

Maximum Time At Peak Reflow Temperature: 30 s

Adherence to peak reflow time standards ensures reliability and quality in assembly processes.

Peak Reflow Temperature: 260

High peak reflow temperature tolerance supports compatibility with modern soldering techniques.

Length: 10 mm

Uniform dimensions (10mm x 10mm) aid in standardization and ease of integration into existing systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and suitability for demanding applications.

Peripheral IC Type: MICROCONTROLLER

Designed as a dedicated microcontroller, it excels in embedded applications and control tasks.

RAM Bytes: 384

384 bytes of RAM is adequate for many applications, facilitating efficient data handling.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals enhance stability and performance during soldering processes.

Analog To Digital Convertors: 12-Ch 10-Bit

12-channel, 10-bit ADC allows for versatile measurement options in applications requiring analog input.

Maximum Supply Current: 10 mA

Low maximum supply current supports power-sensitive applications, extending battery life.

Nominal Supply Voltage: 5 V

The nominal operating voltage of 5 V simplifies design by utilizing widely available components.

PWM Channels: YES

PWM capability allows for precise control of motors and lights in various applications.

Connectivity: SCI, SPI

Multiple connectivity options enhance communication with other devices in a system.

ROM Programmability: FLASH

Flash memory ensures flexibility in program updates and changes without the need for physical replacements.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch is ideal for fine-pitch applications, allowing for high-density designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate handling requirements, making it suitable for many manufacturing processes.

Speed: 8 rpm

Low speed is ideal for applications requiring careful control, such as in robotics or automotive mechanisms.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient instruction execution in microcontroller applications.

No. of I/O Lines: 32

32 I/O lines provide ample connections for external devices, increasing flexibility in project designs.

Technical Specifications

Microcontrollers ST72F32AJ2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F32AJ2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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