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ST72F325K6T6

STMicroelectronics

ST72F325K6T6 by STMicroelectronics

ST72F325K6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 terminals, and operates b/w -40 °C to 85 °C. With 1 KB RAM and 32 KB ROM, it supports ADC and PWM channels for versatile applications. Ideal for industrial use in low-power designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 5,550 parts In-Stock

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Vyrian

USA . 2,890 parts In-Stock

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2,890

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Digiode

USA . 1,223 parts In-Stock

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Anansix

USA . 656 parts In-Stock

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Microchip USA

USA . 455 parts In-Stock

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$5.297

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455

$5.297

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Vigor

Singapore . 3,000 parts In-Stock

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$5.540

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3,000

$5.540

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AZTECH Wire

Italy . 707 parts In-Stock

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$17.150

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707

$17.150

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IDEA Electronic Components Group

UK . 2,357 parts In-Stock

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$65.658

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$59.092

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Component Stockers USA

USA . 763 parts In-Stock

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$99.990

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MKK Technologies

India . 487 parts In-Stock

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$123.465

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487

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DigiPath Technology Company

USA . 487 parts In-Stock

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$123.465

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487

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A-Z Elektronik GmbH

Germany . 7,124 parts In-Stock

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Assy Fe

Spain . 4,500 parts In-Stock

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Corphita

USA . 3,233 parts In-Stock

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Perfect Parts

USA . 3,158 parts In-Stock

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Parana Technologies

USA . 2,077 parts In-Stock

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$78.504

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$78.504

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Overview

Unlock the potential of your next project with the ST72F325K6T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and efficiency, this versatile 8-bit MCU excels across various applications, from industrial automation to consumer electronics. Experience enhanced performance with low power consumption, ensuring longevity and dependability. Partner with STMicroelectronics for cutting-edge technology that delivers value, quality, and unmatched support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount design allows for compact circuit designs and easier integration into modern electronics.

Maximum Supply Voltage: 5.5 V

With a maximum voltage of 5.5 V, this microcontroller can be used in a wide range of power-sensitive applications.

Package Shape: SQUARE

The square package shape optimizes space and layout on PCBs, enhancing design flexibility.

Bit Size: 8

8-bit architecture is suitable for cost-effective and simple applications, while still providing adequate processing power.

No. of Terminals: 32

Having 32 terminals provides ample connection points for I/O operations and peripherals, ensuring versatility in designs.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack and low-profile design aids in maintaining a slim profile for compact electronic devices.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V allows for operation in low-power environments, extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

Withstanding temperatures up to 85 °C makes this microcontroller reliable for industrial applications that experience heat fluctuations.

CPU Family: ST72

The ST72 CPU family is known for its performance and efficiency, providing robust processing capabilities for embedded systems.

No. of External Interrupts: 6

Having 6 external interrupts enhances the microcontroller's responsiveness to external events, making it suitable for real-time applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures that this microcontroller is reliable in harsh environmental conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides corrosion resistance, ensuring the longevity of connections, especially in oxidizing environments.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, enabling a broader range of applications, such as sensor interfacing.

Terminal Position: QUAD

Quad terminal positioning allows for ease of soldering and handling during PCB assembly.

ROM Words: 32768

With 32KB of ROM, this microcontroller can store substantial application code, accommodating complex tasks.

Maximum Seated Height: 1.6 mm

A low seated height contributes to compactness, ideal for space-constrained applications.

Width: 7 mm

A width of 7 mm makes it suitable for installation in small devices without compromising layout space.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz offers adequate performance for most general-purpose applications while keeping power consumption low.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand up to 30 seconds at peak reflow temperatures ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 235

The high peak reflow temperature compatibility ensures durability during assembly without damaging the device.

Length: 7 mm

7 mm length allows this microcontroller to fit easily into space-constrained applications while maintaining connections.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a dedicated microcontroller, it provides integrated functions that streamline the development process.

RAM Bytes: 1024

With 1024 bytes of RAM, it can efficiently handle tasks and data storage for a variety of embedded applications.

Technology: CMOS

CMOS technology implies low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joints, improving reliability and ensuring robust connectivity.

Maximum Supply Current: 15 mA

The low supply current of 15 mA contributes to energy efficiency, critical for battery-powered and low-energy applications.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is a standard value allowing easy compatibility with common power supplies and circuitry.

PWM Channels: YES

The inclusion of PWM channels facilitates various signal control applications, such as motor speed and brightness control.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to application code, enhancing the product’s versatility.

Terminal Pitch: 0.8 mm

A standard terminal pitch of 0.8 mm ensures compatibility with a wide range of PCB designs and assembly processes.

Format: FIXED POINT

Fixed point format is advantageous for applications that require precise calculations without floating-point overhead.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the microcontroller can handle typical manufacturing environments with appropriate precautions.

Speed: 8 rpm

A speed rating of 8 rpm indicates suitability for low-speed control applications, connecting with various motors and actuators.

Low Power Mode: YES

Low power mode functionality is essential for extending the operational life in battery-powered applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows efficient data handling for simpler applications with lower complexity.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller can manage numerous peripherals, enhancing its flexibility in custom application designs.

Technical Specifications

Microcontrollers ST72F325K6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

6

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F325K6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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