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ST72F325K6B6

STMicroelectronics

ST72F325K6B6 by STMicroelectronics

ST72F325K6B6 microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 5.5V, and includes 32 terminals. With a temp range of -40 °C to 85°C, it's ideal for industrial applications requiring reliability. It supports ADC and PWM channels for versatile control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,596 parts In-Stock

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5,596

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Digiode

USA . 2,605 parts In-Stock

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2,605

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Anansix

USA . 1,892 parts In-Stock

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1,892

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Distributors (Availability)

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Microchip USA

USA . 437 parts In-Stock

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$7.143

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437

$7.143

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AZTECH Wire

Italy . 213 parts In-Stock

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$18.180

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213

$18.180

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

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$23.760

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$21.384

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1,040

$23.760

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$21.384

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MKK Technologies

India . 1,937 parts In-Stock

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$44.679

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1,937

$44.679

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DigiPath Technology Company

USA . 1,937 parts In-Stock

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$44.679

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$44.679

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Vigor

Singapore . 6,834 parts In-Stock

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Corphita

USA . 1,933 parts In-Stock

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Parana Technologies

USA . 366 parts In-Stock

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$28.409

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366

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$28.409

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Overview

Elevate your projects with the ST72F325K6B6 microcontroller from STMicroelectronics, a leader in digital innovation. With robust performance and reliability, this versatile 8-bit MCU shines in industrial applications, offering low power consumption and a compact design. Its seamless integration and rich features empower developers to create cutting-edge solutions efficiently, ensuring you stay ahead in today’s competitive landscape. Unlock exceptional value and performance with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in various power supply configurations.

Package Shape: SQUARE

The square shape optimizes space on the PCB, enabling efficient layout designs.

Bit Size: 8

An 8-bit architecture is perfect for cost-effective applications requiring less computational power.

Power Supplies (V): 3.3/5

Compatibility with both 3.3V and 5V supplies enhances versatility for different systems.

No. of Terminals: 32

With 32 terminals, this microcontroller can interface with a substantial number of peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design aids in low-height applications while maintaining a solid electrical performance.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, the microcontroller can operate in a range of power environments.

Maximum Operating Temperature: 85 °C

An extended operating temperature of up to 85 °C allows for usage in industrial and high-temperature settings.

CPU Family: ST72

Belonging to the established ST72 CPU family ensures compatibility and support with a variety of tools and libraries.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes it suitable for extreme environments.

Terminal Finish: MATTE TIN

A matte tin finish provides excellent solderability and enhances reliability over time.

ADC Channels: YES

Included ADC channels allow for analog signal processing, making it ideal for sensor applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout and wiring.

ROM Words: 32768

With 32,768 ROM words, it offers ample program memory for various applications.

Maximum Seated Height: 1.6 mm

A low maximum seated height allows for space-efficient designs in compact devices.

Width: 7 mm

Its 7 mm width makes it suitable for small form-factor applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing speed for most standard tasks.

Length: 7 mm

The compact length of 7 mm allows for high-density arrangements on PCBs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functions, reducing the need for multiple ICs.

RAM Bytes: 1024

1,024 bytes of RAM provide sufficient working memory for many embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals enhance soldering effectiveness, contributing to reliable connections on PCBs.

Maximum Supply Current: 15 mA

With a maximum supply current of 15 mA, it is efficient for battery-powered and low-energy applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many digital circuits, simplifying design considerations.

PWM Channels: YES

PWM channels enable precise control of motors or LEDs, enhancing its application range.

ROM Programmability: FLASH

FLASH programmability allows for ease of updates and reprogramming, beneficial in prototyping and development.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for high-density connections, making the microcontroller suitable for advanced electronic designs.

Speed: 8 rpm

The ability to handle 8 rpm speeds makes it adaptable for various low-speed control tasks.

No. of I/O Lines: 24

With 24 I/O lines, it provides ample connectivity options to interface with external components and sensors.

Technical Specifications

Microcontrollers ST72F325K6B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F325K6B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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