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ST72F324LJ6T6

STMicroelectronics

ST72F324LJ6T6 by STMicroelectronics

ST72F324LJ6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 I/O lines, and operates within -40 °C to 85 °C. With a supply voltage range of 2.85V to 3.6V, it's ideal for industrial applications requiring reliable performance. Its low-profile design and integrated ADC make it versatile for various embedded systems.

Median Price

$8.736

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,080 parts In-Stock

1+ parts

$8.736

100+ parts

$3.785

1k+ parts

$3.582

10k+ parts

-

2,080

$8.736

$3.785

$3.582

-

Vyrian

USA . 7,342 parts In-Stock

1+ parts

-

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-

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7,342

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Digiode

USA . 4,909 parts In-Stock

1+ parts

-

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4,909

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Chip Stock

USA . 4,258 parts In-Stock

1+ parts

-

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4,258

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-

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Lakeland Logistics Inc

USA . 2,080 parts In-Stock

1+ parts

-

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-

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2,080

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-

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Anansix

USA . 1,290 parts In-Stock

1+ parts

-

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1,290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 137 parts In-Stock

1+ parts

$5.544

100+ parts

-

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-

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137

$5.544

-

-

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AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$17.000

100+ parts

-

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-

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-

857

$17.000

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IDEA Electronic Components Group

UK . 2,257 parts In-Stock

1+ parts

$54.139

100+ parts

-

1k+ parts

$48.725

10k+ parts

-

2,257

$54.139

-

$48.725

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Component Stockers USA

USA . 439 parts In-Stock

1+ parts

$99.990

100+ parts

-

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-

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439

$99.990

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MKK Technologies

India . 406 parts In-Stock

1+ parts

$101.805

100+ parts

-

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406

$101.805

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DigiPath Technology Company

USA . 406 parts In-Stock

1+ parts

$101.805

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-

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406

$101.805

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Kepictronics

USA . 11,500 parts In-Stock

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11,500

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Vigor

Singapore . 6,096 parts In-Stock

1+ parts

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6,096

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,695 parts In-Stock

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2,695

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Parana Technologies

USA . 2,165 parts In-Stock

1+ parts

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100+ parts

$64.732

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2,165

-

$64.732

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A-Z Elektronik GmbH

Germany . 1,608 parts In-Stock

1+ parts

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1,608

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Overview

Unlock endless possibilities with the ST72F324LJ6T6 microcontroller from STMicroelectronics, a trusted leader in innovation and quality. Designed for versatile applications ranging from industrial automation to consumer electronics, this low-profile powerhouse delivers robust performance while maintaining energy efficiency. With its rich set of features and superior reliability, you can streamline your designs and enhance product longevity—empowering you to stay ahead in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliability and performance in various applications.

Surface Mount: YES

Surface mount capability allows for compact design and reduced PCB space, making it suitable for modern electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a broad range of power supply options for flexibility in system designs.

Package Shape: SQUARE

Square shape facilitates easier arrangement and better utilization of board space.

Bit Size: 8

8-bit architecture makes it efficient for processing simple instructions and controlling devices.

Power Supplies (V): 3/3.3

Compatible with common voltage levels, ensuring versatility in various applications.

No. of Terminals: 44

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design supports space-constrained applications and enables easy thermal management.

Minimum Supply Voltage: 2.85 V

Allows operation in low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliability under high temperature conditions, making it suitable for industrial applications.

CPU Family: ST72

Part of a trusted family known for performance and efficiency in microcontroller applications.

Minimum Operating Temperature: -40 °C

Suitable for extreme environments, expanding the range of potential applications.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels enable direct sensing of analog signals, enhancing versatility in applications.

Terminal Position: QUAD

Quad terminal position improves routing and reduces noise in PCB design.

ROM Words: 32768

Ample memory allows for complex programs, increasing the product's functionality.

Maximum Seated Height: 1.6 mm

Low profile dimensions facilitate integration into slim devices.

Width: 10 mm

Compact width promotes efficient use of space on PCBs.

Peripherals: TIMER(4)

Multiple timers provide flexibility for various applications, including real-time clock functions.

Maximum Clock Frequency: 16 MHz

Provides sufficient processing power for many real-time applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures compatibility with standard soldering processes, facilitating manufacturing.

Peak Reflow Temperature °C: 260

Designed to withstand high temperatures, ensuring durability during soldering.

Length: 10 mm

Compact length contributes to its suitability for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed for high-reliability application in industrial environments, ensuring consistent performance.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, optimizing performance for embedded applications.

RAM Bytes: 1024

Sufficient RAM for managing data and program execution, facilitating complex task handling.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals ensure easy soldering and good mechanical strength.

Analog To Digital Convertors: 12-Ch 10-Bit

12-channel ADC expands the capacity for diverse sensor applications.

Maximum Supply Current: 7 mA

Low supply current enhances power efficiency in battery-operated devices.

Nominal Supply Voltage: 3 V

Standard operating voltage compatible with many devices, ensuring ease of integration.

PWM Channels: YES

Support for PWM channels enables control of motors and other devices with precision.

Connectivity: SCI, SPI

Multiple communication interfaces allow for versatile connectivity options with other devices.

ROM Programmability: FLASH

Flash memory enables easy upgrades and reprogramming, enhancing long-term usability.

Terminal Pitch: 0.8 mm

Standard terminal pitch ensures compatibility with a wide range of soldering techniques.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity allows for reasonable handling precautions during assembly.

Speed: 8 rpm

Adequate speed for various control applications while maintaining energy efficiency.

On Chip Program ROM Width: 8

8-bit ROM width aligns with the microcontroller's architecture for efficient processing.

No. of I/O Lines: 32

A generous number of I/O lines enables extensive interfacing with peripherals.

Technical Specifications

Microcontrollers ST72F324LJ6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324LJ6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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