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ST72F324K6TA

STMicroelectronics

ST72F324K6TA by STMicroelectronics

ST72F324K6TA microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85 °C. It supports up to 24 I/O lines and includes ADC and PWM channels. Ideal for industrial applications, it operates on a supply voltage of 3.8V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,026 parts In-Stock

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Digiode

USA . 4,567 parts In-Stock

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4,567

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Anansix

USA . 1,855 parts In-Stock

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1,855

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ComSIT Distribution GmbH

Germany . 51 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Microchip USA

USA . 478 parts In-Stock

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$9.647

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478

$9.647

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AZTECH Wire

Italy . 1,026 parts In-Stock

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$19.080

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$19.080

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

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$22.306

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$20.076

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$22.306

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$20.076

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MKK Technologies

India . 1,369 parts In-Stock

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$41.946

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1,369

$41.946

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DigiPath Technology Company

USA . 1,369 parts In-Stock

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$41.946

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$41.946

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Component Stockers USA

USA . 676 parts In-Stock

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$99.990

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Kepictronics

USA . 11,500 parts In-Stock

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Vigor

Singapore . 10,000 parts In-Stock

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Corphita

USA . 2,232 parts In-Stock

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Parana Technologies

USA . 824 parts In-Stock

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$26.671

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Unlock the potential of your next project with the ST72F324K6TA microcontroller from STMicroelectronics—a leader in innovation and reliability. Designed for versatility, this compact powerhouse delivers exceptional performance in industrial applications, ensuring seamless integration and robust functionality. With its low power consumption and wide temperature range, you can trust it to perform reliably in even the toughest conditions. Elevate your designs with quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on printed circuit boards and facilitating automated assembly.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V enables compatibility with a wide range of power supply systems, ensuring flexibility of use.

Package Shape: SQUARE

The square package shape optimizes space usage on the PCB and simplifies the layout design.

Bit Size: 8

An 8-bit architecture allows for simpler applications and can be sufficient for a variety of control tasks.

Power Supplies (V): 3.3

Operating at 3.3V ensures low power consumption, making it energy-efficient for battery-powered applications.

No. of Terminals: 32

With 32 terminals, the microcontroller provides ample connections for various peripherals and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile flatpack design makes it ideal for space-constrained applications, enabling slim device profiles.

Minimum Supply Voltage: 3.8 V

The minimum supply voltage of 3.8V ensures stable operation within a defined range, promoting reliability.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates suitability for industrial environments where heat management is crucial.

CPU Family: ST72

Being part of the ST72 family, it benefits from robust architecture and strong community support for development.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller excels in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes like nickel-palladium-gold ensure excellent conductivity and longevity in connections.

ADC Channels: YES

Built-in ADC channels enable real-time analog signal processing, facilitating a wide range of applications.

Terminal Position: QUAD

Quad terminal positioning aids in efficient spacing and layout on PCBs, enhancing circuit design flexibility.

ROM Words: 32768

With 32,768 ROM words, developers have ample space for code, allowing for complex applications and features.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm ensures compatibility with low-profile designs, fitting well in compact devices.

Width: 7 mm

A width of 7 mm enables efficient use of space in compact electronic designs, fitting into tight layouts.

Maximum Clock Frequency: 16 MHz

Operating at 16 MHz provides sufficient processing power for various tasks while maintaining low power consumption.

Length: 7 mm

The small length of the microcontroller enhances space efficiency, making it suitable for miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability in harsh environments, making this microcontroller suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it can handle multiple tasks including control, communication and data processing.

RAM Bytes: 1024

1,024 bytes of RAM allow for a reasonable amount of variable storage, enabling efficient program execution.

Technology: CMOS

The use of CMOS technology allows for lower power requirements and increased operational efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections to PCB, enhancing assembly efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V balances performance with safe operational thresholds for the microcontroller.

PWM Channels: YES

The inclusion of PWM channels enables precise control over motors and other devices, enhancing versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the program, offering flexibility in development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for higher density designs, fitting more functionality in a smaller area.

Speed: 8 rpm

At 8 rpm, this microcontroller can handle low-speed applications efficiently, ideal for automation tasks.

No. of I/O Lines: 24

With 24 I/O lines, it provides significant interfacing capabilities, suitable for a wide range of applications.

Technical Specifications

Microcontrollers ST72F324K6TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324K6TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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