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ST72F324BK6TAE

STMicroelectronics

ST72F324BK6TAE by STMicroelectronics

ST72F324BK6TAE microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 3.8V and 5.5V, and includes 32 terminals with ADC and PWM channels. Its industrial-grade design supports -40 °C to 85°C temperatures, ideal for robust applications. This low-profile package is perfect for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,149 parts In-Stock

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2,149

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Vyrian

USA . 1,974 parts In-Stock

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1,974

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Digiode

USA . 620 parts In-Stock

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620

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Distributors (Availability)

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AZTECH Wire

Italy . 71 parts In-Stock

1+ parts

$12.900

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71

$12.900

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Microchip USA

USA . 337 parts In-Stock

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$23.863

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337

$23.863

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IDEA Electronic Components Group

UK . 828 parts In-Stock

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$79.037

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$71.133

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828

$79.037

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$71.133

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Component Stockers USA

USA . 213 parts In-Stock

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$99.990

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213

$99.990

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MKK Technologies

India . 1,084 parts In-Stock

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$148.624

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1,084

$148.624

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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$148.624

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$148.624

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Parana Technologies

USA . 1,467 parts In-Stock

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$94.501

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$94.501

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Corphita

USA . 1,262 parts In-Stock

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Vigor

Singapore . 1,200 parts In-Stock

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Overview

Elevate your projects with the ST72F324BK6TAE microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for reliability, this versatile 8-bit MCU excels in industrial applications, offering robust performance in challenging environments. With its low-profile design and diverse I/O capabilities, it ensures seamless integration into your designs, delivering efficiency and durability that empower your next breakthrough. Experience superior value and flexibility with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material choice enhances the reliability and performance of the microcontroller in various applications.

Surface Mount: YES

Allows for high-density circuit board layouts, making it suitable for compact electronic devices.

Maximum Supply Voltage: 5.5 V

Offers flexibility in design by accommodating a standard voltage range, making it compatible with various power supplies.

Package Shape: SQUARE

A compact shape that optimizes space on the PCB, allowing for more components to be integrated.

Bit Size: 8

Ideal for many embedded applications that require efficient processing with a smaller code footprint.

Power Supplies (V): 3.3/5

Dual supply voltage capability ensures broad compatibility with existing systems and flexibility in design.

No. of Terminals: 32

Provides ample connectivity options for peripheral devices, sensors, and actuators in complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables low-profile designs, which are essential for space-constrained applications.

Minimum Supply Voltage: 3.8 V

A wider operational range allows the microcontroller to function efficiently in varying power supply conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperature tolerance is required.

CPU Family: ST72

Part of a well-established family known for reliability and performance in embedded systems.

Minimum Operating Temperature: -40 °C

Enables operation in harsh environments, making it suitable for automotive and industrial applications.

Terminal Finish: TIN

Provides good solderability and corrosion resistance, enhancing robustness in various environmental conditions.

ADC Channels: YES

Includes analog-to-digital conversion capabilities for interfacing with real-world signals, increasing application versatility.

Terminal Position: QUAD

Offers efficient space utilization on PCBs, allowing for easier routing and design.

ROM Words: 32768

Provides sufficient memory for program storage, enabling more complex applications and functionalities.

Maximum Seated Height: 1.6 mm

Ensures compatibility with low-profile designs and space-saving applications.

Width: 7 mm

Compact dimensions help in designing smaller devices without compromising performance.

Maximum Clock Frequency: 16 MHz

Allows for decent processing speeds for executing complex algorithms and handling real-time tasks.

Length: 7 mm

Small size enhances versatility in embedding the microcontroller within a variety of devices.

Temperature Grade: INDUSTRIAL

Specifically designed for demanding conditions, ensuring reliability and longevity in critical applications.

Peripheral IC Type: MICROCONTROLLER

Ideal for controlling various peripherals, making it versatile for a multitude of applications.

RAM Bytes: 1024

Provides sufficient RAM for handling data processing tasks in embedded applications.

Technology: CMOS

Enables low power consumption while maintaining high performance, critical for battery-operated devices.

Terminal Form: GULL WING

Facilitates easy and reliable PCB soldering, ensuring strong electrical connections.

Maximum Supply Current: 7 mA

Low current consumption contributes to efficient power usage, beneficial for battery-operated applications.

Nominal Supply Voltage: 5 V

Standard voltage levels simplify integration with existing circuits and systems.

PWM Channels: YES

Enables control of motors and other devices that require pulse-width modulation, expanding application possibilities.

ROM Programmability: FLASH

Allows for easy reprogramming of applications, providing flexibility for updates and changes.

Terminal Pitch: 0.8 mm

Allows for better space management on PCBs while ensuring reliable connectivity.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, guiding proper handling and storage.

Speed: 8 rpm

Suitable for applications requiring slow-speed actuation, ideal for control systems.

No. of I/O Lines: 24

Offers a significant number of input/output lines for interfacing with multiple devices simultaneously.

Technical Specifications

Microcontrollers ST72F324BK6TAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324BK6TAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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