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ST72F324BK2TAE

STMicroelectronics

ST72F324BK2TAE by STMicroelectronics

ST72F324BK2TAE microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 5.5V, and supports up to 24 I/O lines. Ideal for industrial applications, it offers robust performance with a -40 °C to 85°C temp range. Its low-profile design ensures efficient integration in compact devices.

Median Price

$55.558

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$55.558

100+ parts

-

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10k+ parts

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70

$55.558

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Vyrian

USA . 8,461 parts In-Stock

1+ parts

-

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8,461

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Anansix

USA . 2,595 parts In-Stock

1+ parts

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2,595

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Digiode

USA . 157 parts In-Stock

1+ parts

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157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 458 parts In-Stock

1+ parts

$6.133

100+ parts

-

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458

$6.133

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AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$12.910

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-

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10k+ parts

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400

$12.910

-

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IDEA Electronic Components Group

UK . 2,332 parts In-Stock

1+ parts

$14.984

100+ parts

-

1k+ parts

$13.486

10k+ parts

-

2,332

$14.984

-

$13.486

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MKK Technologies

India . 2,154 parts In-Stock

1+ parts

$28.177

100+ parts

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2,154

$28.177

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DigiPath Technology Company

USA . 2,154 parts In-Stock

1+ parts

$28.177

100+ parts

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2,154

$28.177

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Component Stockers USA

USA . 554 parts In-Stock

1+ parts

$99.990

100+ parts

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554

$99.990

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Vigor

Singapore . 4,720 parts In-Stock

1+ parts

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4,720

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Corphita

USA . 2,645 parts In-Stock

1+ parts

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2,645

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Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

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100+ parts

$17.916

1k+ parts

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10k+ parts

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1,372

-

$17.916

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Overview

Elevate your projects with the ST72F324BK2TAE microcontroller from STMicroelectronics, a trusted leader in innovative technology. This compact powerhouse delivers reliability and performance for diverse applications, from consumer electronics to industrial automation. With its low power consumption and robust design, it ensures seamless integration and longevity. Experience superior quality and unmatched support, making your development journey smoother and more efficient than ever!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface-mount capability allows for compact designs and efficient manufacturing processes, ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely within common voltage levels in electronic systems.

Package Shape: SQUARE

The square package shape facilitates efficient layout designs and optimizes space utilization on printed circuit boards.

Bit Size: 8

An 8-bit architecture is widely compatible with various applications, offering simplicity and suitability for low-power devices.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V operation makes this microcontroller versatile for integrating with different systems and components.

No. of Terminals: 32

Having 32 terminals provides ample connections for peripherals and I/O devices, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design contributes to reduced space requirements and improved thermal performance in compact applications.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V allows for operation in a range of environments, accommodating multiple application requirements.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can perform reliably in a variety of industrial settings.

CPU Family: ST72

The ST72 CPU family is known for its performance and reliability, which enhances the overall dependability of the microcontroller.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures that this microcontroller can function in extreme conditions, making it suitable for industrial applications.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and enhances solderability, leading to a more reliable connection on PCBs.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, expanding the microcontroller’s application in sensor interfacing.

Terminal Position: QUAD

Quad terminal positioning optimizes space on the PCB and provides efficient connections for various components.

ROM Words: 8192

With 8192 ROM words available, this microcontroller supports substantial program storage for complex tasks and applications.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6 mm facilitates its integration into compact systems, saving space without sacrificing performance.

Width: 7 mm

At 7 mm wide, this microcontroller is designed for tight spaces, allowing it to fit seamlessly into various electronic designs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz enables efficient processing power for executing tasks quickly and reliably.

Maximum Time At Peak Reflow Temperature: 40 s

This specification indicates enhanced thermal resilience during soldering processes, which is crucial for ensuring component integrity.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature marks its compatibility with modern soldering techniques, ensuring reliable assembly.

Length: 7 mm

A compact length of 7 mm makes it ideal for applications where space is at a premium, contributing to overall design efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures functionality in harsh environments, ideal for industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates core processing functions with peripheral capabilities, streamlining design complexity.

RAM Bytes: 384

384 bytes of RAM provide adequate temporary data storage for applications, balancing performance and resource optimization.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easier assembly and soldering on PCBs, enhancing manufacturing efficiency.

Maximum Supply Current: 7 mA

A maximum supply current of 7 mA indicates low power consumption, making the microcontroller suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many applications, ensuring compatibility with a wide range of components.

PWM Channels: YES

The availability of PWM channels allows for precise control of motors and lights, making it versatile for various control applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing the microcontroller's flexibility and usability.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for high-density designs, supporting compact layouts and optimizing PCB space.

Speed: 8 rpm

While the speed may refer to a specific application, it indicates an operational capability that can be tailored to various use cases.

No. of I/O Lines: 24

Having 24 I/O lines enables extensive interaction with peripherals, facilitating complex projects and design flexibility.

Technical Specifications

Microcontrollers ST72F324BK2TAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3/e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324BK2TAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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