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ST72F324BJ2B6

STMicroelectronics

ST72F324BJ2B6 by STMicroelectronics

ST72F324BJ2B6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 12 ADC channels. With a temp range of -40 °C to 85 °C, it's ideal for industrial applications requiring reliable performance. Its compact design supports various connectivity options like SCI and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,919 parts In-Stock

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7,919

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Anansix

USA . 2,897 parts In-Stock

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2,897

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Digiode

USA . 395 parts In-Stock

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395

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Distributors (Availability)

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Microchip USA

USA . 130 parts In-Stock

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$8.411

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130

$8.411

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AZTECH Wire

Italy . 220 parts In-Stock

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$9.940

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220

$9.940

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IDEA Electronic Components Group

UK . 617 parts In-Stock

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$57.375

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$51.637

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617

$57.375

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$51.637

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MKK Technologies

India . 1,992 parts In-Stock

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$107.890

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1,992

$107.890

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DigiPath Technology Company

USA . 1,992 parts In-Stock

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$107.890

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1,992

$107.890

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Vigor

Singapore . 9,172 parts In-Stock

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Corphita

USA . 3,176 parts In-Stock

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Parana Technologies

USA . 2,009 parts In-Stock

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$68.600

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Elevate your projects with the ST72F324BJ2B6 microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for reliability and versatility, this 8-bit powerhouse excels in industrial applications, offering a robust performance under extreme conditions. With integrated ADC channels and multiple timers, it empowers seamless control for various devices. Experience superior quality and unmatched support, ensuring your solutions are both effective and future-ready.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making the microcontroller suitable for long-term applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely in a variety of electronic projects without the risk of overvoltage damage.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and easy integration into designs.

Bit Size: 8

An 8-bit architecture enables straightforward applications while keeping the design simple and cost-effective.

Power Supplies (V): 5

Designed for a nominal supply voltage of 5 V, which is a common standard in microcontrollers, ensuring ease of integration with existing systems.

No. of Terminals: 42

The 42 terminals provide ample connection points for various peripherals, enhancing the microcontroller's functionality.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch design is suitable for tighter spaces, enabling more compact circuit designs.

Minimum Supply Voltage: 3.8 V

With a low minimum supply voltage of 3.8 V, this microcontroller can operate in low-power conditions, perfect for battery-operated devices.

Maximum Operating Temperature: 85 °C

The microcontroller can operate at high temperatures, making it suitable for industrial applications where heat is a concern.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from established performance, community support, and compatibility with many peripherals.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold conditions (-40 °C) makes this product ideal for outdoor or industrial applications.

Terminal Finish: TIN

The tin terminal finish enhances solderability and reliability in assembly, leading to stable connections.

ADC Channels: YES

The presence of ADC channels allows for digital conversion of analog signals, making this microcontroller versatile in real-world applications.

Terminal Position: DUAL

Dual terminal positioning aids in more flexible PCB designs and simplifies the routing of the connections.

ROM Words: 8192

With 8192 ROM words, this microcontroller has sufficient memory for storing essential programs and data.

Maximum Seated Height: 5.08 mm

The compact height allows for more flexibility in PCB design and can help save space in device enclosures.

Width: 15.24 mm

The slim width ensures easier integration into smaller electronic devices without sacrificing performance.

Peripherals: POR, TIMER(4)

Included peripherals such as a power-on reset and four timers enhance the microcontroller's functionality, making it suitable for complex applications.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz, this microcontroller can handle moderate processing tasks efficiently.

Length: 36.83 mm

The length offers a balanced footprint for fitting within various projects while maximizing pin accessibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh environments, appealing to industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for various control and processing tasks, making it a reliable core component for devices.

RAM Bytes: 384

With 384 bytes of RAM, this microcontroller provides enough space for temporary data storage and execution of applications.

Technology: CMOS

Using CMOS technology, this microcontroller is energy-efficient, leading to lower power consumption during operation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easier handling during assembly and provides strong mechanical stability.

Analog To Digital Convertors: 12-Ch 10-Bit

The 12-channel, 10-bit ADC capability enhances the microcontroller's ability to interact with various sensors, thereby increasing application versatility.

Maximum Supply Current: 5.5 mA

A maximum supply current of 5.5 mA ensures that the microcontroller is energy-efficient, extending battery life in portable applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V enhances compatibility with many devices and power sources, simplifying design integration.

PWM Channels: YES

The inclusion of PWM channels allows the microcontroller to be used for motor control and dimming applications, broadening its usage range.

Connectivity: SCI, SPI

The support for SCI and SPI protocols facilitates easy communication with other devices and components in various applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the code, enhancing the product's longevity and adaptability.

Terminal Pitch: 1.778 mm

The 1.778 mm terminal pitch is standard, allowing for compatibility with a wide range of PCBs and connectors.

Speed: 8 rpm

With a speed of 8 rpm, this microcontroller can perform operations efficiently in time-sensitive applications.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 bits further simplifies data handling and processing tasks while maintaining compatibility.

No. of I/O Lines: 32

Offering 32 I/O lines provides sufficient interfacing options for numerous peripherals, enhancing its overall functionality.

Technical Specifications

Microcontrollers ST72F324BJ2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

Length:

36.83 mm

No. of I/O Lines:

32

No. of Terminals:

42

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324BJ2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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