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ST72F321BR6T6

STMicroelectronics

ST72F321BR6T6 by STMicroelectronics

ST72F321BR6T6 by STMicroelectronics is an 8-bit microcontroller with 64 terminals, operating at a max clock frequency of 16 MHz. It features 1024 bytes of RAM, 32768 ROM words, and PWM channels for industrial applications requiring low profile packaging and a supply voltage range of 3.3-5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,906 parts In-Stock

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6,906

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Anansix

USA . 2,606 parts In-Stock

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2,606

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Digiode

USA . 1,010 parts In-Stock

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1,010

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ComSIT Distribution GmbH

Germany . 8 parts In-Stock

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8

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Distributors (Availability)

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Microchip USA

USA . 301 parts In-Stock

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$6.630

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301

$6.630

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AZTECH Wire

Italy . 895 parts In-Stock

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$11.560

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895

$11.560

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IDEA Electronic Components Group

UK . 736 parts In-Stock

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$26.911

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$24.220

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736

$26.911

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$24.220

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MKK Technologies

India . 2,036 parts In-Stock

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$50.604

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2,036

$50.604

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DigiPath Technology Company

USA . 2,036 parts In-Stock

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$50.604

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$50.604

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Component Stockers USA

USA . 674 parts In-Stock

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$99.990

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674

$99.990

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Vigor

Singapore . 7,086 parts In-Stock

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Corphita

USA . 3,397 parts In-Stock

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Parana Technologies

USA . 2,378 parts In-Stock

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$32.176

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$32.176

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Overview

Unlock the power of innovation with the ST72F321BR6T6 microcontroller by STMicroelectronics. Designed with precision and quality in mind, this device is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With its advanced features and reliable performance, customers can trust in the value and benefits that this product brings to their projects. Experience seamless integration, superior functionality, and unmatched efficiency with the ST72F321BR6T6. Elevate your designs to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape makes it easier to align and mount on a PCB compared to irregular shapes.

Bit Size: 8

Ideal for applications that require processing small chunks of data efficiently.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages enables compatibility with different systems.

No. of Terminals: 64

Sufficient number of terminals for connecting to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile package style saves space in compact applications.

Minimum Supply Voltage: 3.8 V

Wide range of supply voltage options for different power requirements.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges.

CPU Family: ST72

Part of a reliable and well-established CPU family known for performance and stability.

Minimum Operating Temperature: -40 °C

Allows for operation in harsh environments with low temperatures.

ADC Channels: YES

Integrated ADC channels for analog input signals, expanding the range of applications.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and connections.

ROM Words: 32768

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for applications with height constraints.

Width: 14 mm

Compact width size for space-saving PCB designs.

Maximum Clock Frequency: 16 MHz

High clock frequency for quick processing and response times.

Length: 14 mm

Compact length size for space-saving PCB designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral ICs for additional functionality and features.

RAM Bytes: 1024

Sufficient RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable connections.

Maximum Supply Current: 8 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with many systems.

PWM Channels: YES

Integrated PWM channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to firmware.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact PCB designs and high-density connections.

Speed: 8 rpm

Operates at a speed of 8 rpm, suitable for various applications.

No. of I/O Lines: 48

Sufficient number of I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers ST72F321BR6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F321BR6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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