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ST72F321AR6T6

STMicroelectronics

ST72F321AR6T6 by STMicroelectronics

ST72F321AR6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 64 terminals, and operates b/w -40 °C to 85°C. With 32KB ROM and 1KB RAM, it supports I2C, SPI connectivity for industrial applications. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

$4.704

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 262 parts In-Stock

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-

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$4.249

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262

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$4.249

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Arrow

USA . 160 parts In-Stock

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-

100+ parts

-

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$5.158

10k+ parts

$4.469

160

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-

$5.158

$4.469

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,361 parts In-Stock

1+ parts

-

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7,361

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Digiode

USA . 3,942 parts In-Stock

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3,942

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Anansix

USA . 2,490 parts In-Stock

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2,490

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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Distributors (Availability)

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Microchip USA

USA . 208 parts In-Stock

1+ parts

$10.803

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-

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208

$10.803

-

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IDEA Electronic Components Group

UK . 1,615 parts In-Stock

1+ parts

$15.966

100+ parts

-

1k+ parts

$14.369

10k+ parts

-

1,615

$15.966

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$14.369

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AZTECH Wire

Italy . 641 parts In-Stock

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$17.110

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641

$17.110

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MKK Technologies

India . 1,044 parts In-Stock

1+ parts

$30.022

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-

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1,044

$30.022

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DigiPath Technology Company

USA . 1,044 parts In-Stock

1+ parts

$30.022

100+ parts

-

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1,044

$30.022

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A-Z Elektronik GmbH

Germany . 6,833 parts In-Stock

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6,833

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Vigor

Singapore . 1,900 parts In-Stock

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1,900

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Parana Technologies

USA . 1,619 parts In-Stock

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$19.089

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1,619

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$19.089

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Perfect Parts

USA . 1,098 parts In-Stock

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1,098

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Corphita

USA . 433 parts In-Stock

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433

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Overview

Elevate your next project with the ST72F321AR6T6 microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for reliability in industrial applications, this flexible device offers exceptional performance within extreme temperatures and low power consumption. With integrated ADC capabilities and versatile connectivity options, it simplifies complex designs while ensuring durability. Experience superior functionality and peace of mind with STMicroelectronics—where excellence meets efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and minimized board space, enabling high-density applications.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage levels, ensuring compatibility with various power supply systems.

Package Shape: SQUARE

The square shape contributes to uniformity in circuit board layout, facilitating easier placement and routing.

Bit Size: 8

An 8-bit architecture strikes a balance between performance and resource efficiency, ideal for many embedded applications.

Power Supplies (V): 3.8/5.5

Flexible power supply options enhance integration into different systems, improving versatility.

No. of Terminals: 64

A high terminal count allows for extensive interfacing capabilities, accommodating complex peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design enables compact layouts and is suitable for space-constrained applications.

Minimum Supply Voltage: 3.8 V

The lower voltage requirement enhances efficiency in battery-powered designs, extending operational life.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it suitable for industrial environments where thermal management can be challenging.

CPU Family: ST72

Part of the established ST72 family, ensuring a solid foundation of support and resources for developers.

Minimum Operating Temperature: -40 °C

Extensive temperature range supports deployment in harsh conditions, enhancing reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves solderability and enhances long-term reliability against oxidation.

ADC Channels: YES

Integrated ADC channels enable direct sensing and conversion of analog signals, increasing functional capability.

Terminal Position: QUAD

Quad terminal layout provides robust mechanical stability and ease of connection to PCBs.

ROM Words: 32768

Ample ROM size allows for significant program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low seated height is advantageous for space-saving designs, minimizing overall profile.

Width: 10 mm

Compact width aids in tight layout designs, contributing to miniaturization efforts.

Peripherals: POR, TIMER(5)

Integrated peripherals offer essential functionality, reducing the need for external components.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency provides a suitable performance level for various control tasks and operations.

Maximum Time At Peak Reflow Temperature (s): 30

This parameter ensures compatibility with standard soldering processes, boosting production efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature supports the use of lead-free soldering processes, aligning with modern manufacturing standards.

Length: 10 mm

Short length is ideal for compact designs, allowing for efficient use of space on PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade components are engineered for superior reliability and performance under demanding conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller designation indicates versatility and readiness for a wide range of embedded applications.

RAM Bytes: 1024

Sufficient RAM size supports complex calculations and data processing, enhancing application performance.

Technology: CMOS

CMOS technology allows for low power consumption, which is critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and placement, improving assembly efficiency.

Analog To Digital Convertors: 16-Ch 10-Bit

16-channel 10-bit ADCs enhance measurement capabilities, making it ideal for sensor interfaces.

Maximum Supply Current: 15 mA

Low supply current contributes to energy-efficient designs, vital for battery life and sustainable operation.

Nominal Supply Voltage: 4 V

Operating at a nominal voltage of 4 V balances power efficiency and performance requirements.

PWM Channels: YES

Inclusion of PWM channels is essential for motor control and various application scenarios requiring modulation.

Connectivity: I2C, SCI, SPI

Multiple connectivity options allow easy integration with various sensors and other devices, expanding functionality.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing product longevity and flexibility.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable compact designs, crucial for space-constrained environments.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding proper handling and storage procedures.

Speed: 8 rpm

This speed rating implies adequate performance for applications requiring moderate processing speed.

On Chip Program ROM Width: 8

8-bit ROM width provides sufficient capacity for storing embedded applications, balancing size and functionality.

No. of I/O Lines: 48

A generous number of I/O lines allows for extensive interfacing capabilities, making it adaptable to various applications.

Technical Specifications

Microcontrollers ST72F321AR6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

POR, TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321AR6T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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