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ST72C334J4T6

STMicroelectronics

ST72C334J4T6 by STMicroelectronics

ST72C334J4T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates b/w -40 °C to 85 °C, and includes 16KB of FLASH ROM. With a compact flatpack design and 44 terminals, it's ideal for industrial applications requiring reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,100 parts In-Stock

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Vyrian

USA . 6,645 parts In-Stock

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6,645

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Digiode

USA . 2,291 parts In-Stock

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Anansix

USA . 1,659 parts In-Stock

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1,659

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AZTECH Wire

Italy . 837 parts In-Stock

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$14.920

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837

$14.920

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Microchip USA

USA . 102 parts In-Stock

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$20.567

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102

$20.567

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IDEA Electronic Components Group

UK . 2,284 parts In-Stock

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$32.850

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$29.565

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$32.850

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$29.565

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MKK Technologies

India . 1,783 parts In-Stock

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$61.771

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$61.771

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DigiPath Technology Company

USA . 1,783 parts In-Stock

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$61.771

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Perfect Parts

USA . 21,146 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 4,775 parts In-Stock

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Parana Technologies

USA . 2,340 parts In-Stock

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$39.277

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Vigor

Singapore . 1,450 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,308 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9 parts In-Stock

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Overview

Unlock the power of innovation with the ST72C334J4T6 microcontroller from STMicroelectronics. Renowned for quality and reliability, STMicroelectronics delivers exceptional performance in a compact design, perfect for industrial applications. With impressive temperature resilience and low power consumption, this versatile 8-bit MCU ensures peak efficiency in demanding environments. Elevate your projects with unmatched durability and advanced features that make development seamless and effective.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space in electronic assemblies.

Package Shape: SQUARE

The square package shape enhances the ease of handling and placement on printed circuit boards.

Bit Size: 8

An 8-bit architecture is ideal for applications requiring simple computations and control tasks, ensuring efficient processing.

Power Supplies (V): 3.5/5.5

The flexible supply voltage range makes this microcontroller adaptable to various power requirements.

No. of Terminals: 44

With 44 terminals, this microcontroller offers ample connectivity options for diverse applications.

Package Style (Meter): FLATPACK

The flat pack style allows for a low profile which is beneficial in space-constrained designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from established support and documentation for developers.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is suitable for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position helps in efficient layout design and provides good pin accessibility for connections.

ROM Words: 16384

With 16,384 ROM words, there's sufficient memory for storing essential firmware and data.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows compatibility with lead-free soldering processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies reliability and robustness in challenging environments.

RAM Bytes: 512

With 512 bytes of RAM, this microcontroller is efficient for handling transient data during operations.

Technology: CMOS

CMOS technology allows for low power consumption, making this microcontroller efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and facilitate easy inspection.

ROM Programmability: FLASH

The flash ROM programmability allows for easy updates and reprogramming of firmware.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is suitable for high-density PCB layouts while maintaining ease of soldering.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates this microcontroller can be handled under normal conditions, with some precautions for moisture.

Speed: 8 rpm

Operating at 8 rpm makes this microcontroller ideal for control applications requiring moderate processing speed.

Technical Specifications

Microcontrollers ST72C334J4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

ST72

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.5/5.5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

8 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ST72C334J4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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