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M93C66-MN6P

STMicroelectronics

M93C66-MN6P by STMicroelectronics

M93C66-MN6P by STMicroelectronics is a 256x16 EEPROM with a 5V supply, ideal for industrial applications. It features a max clock frequency of 2 MHz and offers software write protection. With an endurance of 1M cycles, it's perfect for reliable data storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,917 parts In-Stock

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4,917

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Anansix

USA . 2,387 parts In-Stock

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2,387

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Digiode

USA . 1,175 parts In-Stock

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1,175

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ComSIT Distribution GmbH

Germany . 95 parts In-Stock

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95

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IDEA Electronic Components Group

UK . 1,347 parts In-Stock

1+ parts

$2.895

100+ parts

-

1k+ parts

$2.606

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-

1,347

$2.895

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$2.606

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MKK Technologies

India . 1,585 parts In-Stock

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$5.444

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1,585

$5.444

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DigiPath Technology Company

USA . 1,585 parts In-Stock

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$5.444

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1,585

$5.444

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AZTECH Wire

Italy . 849 parts In-Stock

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$12.110

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849

$12.110

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Microchip USA

USA . 310 parts In-Stock

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$21.299

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310

$21.299

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Component Stockers USA

USA . 317 parts In-Stock

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$99.990

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317

$99.990

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A-Z Elektronik GmbH

Germany . 5,007 parts In-Stock

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5,007

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Alle Elektronik GmbH

Germany . 3,338 parts In-Stock

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3,338

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Corphita

USA . 2,488 parts In-Stock

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Parana Technologies

USA . 21 parts In-Stock

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$3.462

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$3.462

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Overview

Unlock unparalleled reliability and performance with the M93C66-MN6P EEPROM from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution perfect for a range of applications—from industrial automation to consumer electronics. With exceptional data retention, efficient power consumption, and flexible write protection, this compact memory chip empowers your designs while ensuring longevity and peace of mind. Elevate your projects with trusted technology that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various applications.

Surface Mount: YES

Compatible with modern PCB designs, allowing for compact and efficient layouts.

Package Shape: RECTANGULAR

Standard shape facilitates easy integration into existing equipment.

Operating Mode: SYNCHRONOUS

Improved speed and efficiency during data transfers compared to asynchronous modes.

Nominal Supply Voltage / Vsup (V): 5

Common voltage level ensures compatibility with a wide range of devices and systems.

Power Supplies (V): 5

Single supply voltage simplifies the power design of the circuit.

No. of Terminals: 8

Provides all necessary connections in a compact form factor.

Package Style (Meter): SMALL OUTLINE

Ideal for space-constrained applications while maintaining performance.

Alternate Memory Width: 8

Flexibility in data operations, accommodating various system architectures.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, able to withstand higher temperatures.

Organization: 256X16

Allows for efficient data storage and retrieval, optimizing access times.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme environments essential for industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

Enhances connectivity and corrosion resistance, prolonging lifespan and reliability.

Terminal Position: DUAL

Facilitates better layout options for circuit designers, enhancing design flexibility.

Write Protection: SOFTWARE

Provides added security against accidental writes, preserving critical data integrity.

Maximum Seated Height: 1.75 mm

Thin profile allows for stackable designs in high-density applications.

Maximum Clock Frequency (fCLK): 2 MHz

Offers decent speed for most standard applications while maintaining low power consumption.

Width: 3.9 mm

Compact width allows for space-efficient designs in tight layouts.

Minimum Supply Voltage (Vsup): 4.5 V

Provides flexibility in power supply design, accommodating minor voltage variations.

Length: 4.9 mm

Space-efficient length, optimizing PCB real estate.

Temperature Grade: INDUSTRIAL

Designed for long-term reliability in harsh environments typical for industrial applications.

Technology: CMOS

Low power consumption and high integration capability make it suitable for portable devices.

Parallel or Serial: SERIAL

Serial interface leads to simpler wiring and reduced pin count compared to parallel types.

Terminal Form: GULL WING

Easy to solder and provides a stable footprint for the device on the PCB.

Maximum Supply Current: 2 mA

Low current consumption enhances energy efficiency in battery-powered applications.

No. of Words: 256 words

Adequate memory for various applications, enabling efficient data storage.

Memory Width: 16

Allows simultaneous read/write operations, enhancing overall throughput.

Minimum Data Retention Time: 40

Secure data integrity over time, important for mission-critical applications.

Terminal Pitch: 1.27 mm

Standard pitch facilitates ease of soldering and compatibility with soldering practices.

No. of Words Code: 256

Sufficient coding capacity for diverse applications without unnecessary complexity.

Maximum Supply Voltage (Vsup): 5.5 V

Offers a range for operation, ensuring robustness in various electrical environments.

Endurance: 1000000 Write/Erase Cycles

High endurance translates to longer product life and reliability in applications with frequent updates.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycles contribute to efficient system performance and reduced latency.

Memory Density: 4096 bit

Adequate density for most embedded applications, balancing performance and size.

Memory IC Type: EEPROM

Non-volatile memory retention makes it suitable for applications needing data preservation.

Maximum Standby Current: 0.00005 Amp

Extremely low standby current enhances energy efficiency, prolonging battery life in portable devices.

Technical Specifications

EEPROM M93C66-MN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.00005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C66-MN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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